1 / 15

Model Connection Protocol extensions for Mixed Signal SiP

Model Connection Protocol extensions for Mixed Signal SiP. Version 0.1 T. Kukal 22 nd Sep, 2010. Agenda. Mixed Signal SiP IR-drop flow Extensions required for Mixed Signal SiP. Current MCP scope. DIE-Digital. Package. Board. October 1, 2014. 3. MCP extended to Mixed Signal.

bat
Download Presentation

Model Connection Protocol extensions for Mixed Signal SiP

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript


  1. Model Connection Protocol extensions for Mixed Signal SiP Version 0.1 T. Kukal 22nd Sep, 2010

  2. Agenda • Mixed Signal SiP IR-drop flow • Extensions required for Mixed Signal SiP

  3. Current MCP scope DIE-Digital Package Board October 1, 2014 3

  4. MCP extended to Mixed Signal DIE-Analog DIE-Digital Package Board Module (Example RFmodule, SMDs) October 1, 2014 4

  5. Mixed Signal IR-drop Task Flow Schematic driven Analog SiP & Circuit Design Schematic Capture Analog IR-drop (schematic simulation driven Pre- & Post-Layout Simulation Passive Structures MCP Logical SiP Layout Analog IC Layout Power-RAIL extract Power-Net Extract SiP IC Digital IR-drop Digital IC layout HDL MCP Physical Power-Net Extract

  6. Extensions over existing MCP (PTMF) • Support for I/F group (netname with-in DIE or grp with-in DIE) • For cases where port-grp1_pkg connects to say port-grp2&3_DIE • Support for I/F part like IO-cellname, R1:1 (pin 1 of R1), CONN:1 (pin1 of PCB connector) • Needed to connect by names as against x-y locations that work well for DIE but not as well for others – also important for Analog • Support for Module in connect-type • Needed for RFmodules, Passives, SMD components… • Support for Extended-nets • Needed for Signal nets (Example series terminations in signals)

  7. I/F group mapping to Connecting Structure Package: .Subckt bp1 dp1 DIE .Subckt D1A D1B D2 Board dp1 VDD bp1 Pin1 dp1 VDD 5 4 D1A Pin2 dp1 VDD 6 4 D1A Pin3 dp1 VDD 7 4 D1A Pin4 dp1 VDD 8 4 D1B Pin5 dp1 VDD 9 4 D1B

  8. Extensions over existing MCP (PTMF) • Support for I/F group (netname with-in DIE or grp with-in DIE) • For cases where port-grp1_pkg connects to say port-grp2&3_DIE • Support for I/F part like IO-cellname, R1:1 (pin 1 of R1), CONN:1 (pin1 of PCB connector) • Needed to connect by names as against x-y locations that work well for DIE but not as well for others – also important for Analog • Support for Module in connect-type • Needed for RFmodules, Passives, SMD components… • Support for Extended-nets • Needed for Signal nets (Example series terminations in signals) October 1, 2014 8

  9. IR-drop of analog DIE in context of passive structures • Simulating Analog DIE in package schematics with loading from passive structures connected to DIE • The simulation data is post-processed to obtain IR-drop at power-rails [connection type MODULE] Pin1 dp1 VDD 5 4 varistor1:2 //Reference_design:pin// Pin2 dp1 VDD 6 4 varistor2:2 Pin3 dp1 VDD 7 4

  10. Extensions over existing MCP • Support for I/F group (netname with-in DIE or grp with-in DIE) • For cases where port-grp1_pkg connects to say port-grp2&3_DIE • Support for I/F part like IO-cellname, R1:1 (pin 1 of R1), CONN:1 (pin1 of PCB connector) • Needed to connect by names as against x-y locations that work well for DIE but not as well for others – also important for Analog • Support for Module in connect-type • Needed for RFmodules, Passives, SMD components… • Support for Extended-nets • Needed for Signal nets (Example series terminations in signals) October 1, 2014 10

  11. Support for Passives, RFModules, PoPs, SMDs • MCP • [connection type] MODULE • MCP • [connection type] PKG RF-Module geometry / s-parameter

  12. Extensions over existing MCP • Support for I/F group (netname with-in DIE or grp with-in DIE) • For cases where port-grp1_pkg connects to say port-grp2&3_DIE • Support for I/F part like IO-cellname, R1:1 (pin 1 of R1), CONN:1 (pin1 of PCB connector) • Needed to connect by names as against x-y locations that work well for DIE but not as well for others – also important for Analog • Support for Module in connect-type • Needed for RFmodules, Passives, SMD components… • Support for Extended-nets • Needed for Signal nets (Example series terminations in signals) October 1, 2014 12

  13. Extended Nets • Series terminations • Extended net needs to have all associated nets mentioned • “”data1a, data1b, data1c”

  14. Summary: MCP format updated in context of Mixed Signal contents Module I/F part-ref (if-module) I/F grp Extended-Net

More Related