Standard Operation Procedures

1. Standard Operation Procedures AG610I-RTA

2. 1.Check to see if the system is Ok • Check to see if the system is on operation condition (green label). • Check the foregoing records in the working sheet. • Check the gas valves (N2O and O2 gases can not be opened at the same time). • Check to see if the cooling water is in the correct level.

3. 2.Turn on the system • User utility permit & personal password to turn on the system. After that, the screen show the window of main menu. • To enter a mode requiring an access code, use the trackball to select the desired mode and let the system automatically prompt for the access code

4. 3.process parameter setting P • Select the “Recipe” in the main menu to set the process parameters.“Recipe” includes temperature curve parameter setting and temperature control parameter seeting. • The temperature range is 400 to 1050 ℃. The time range is 1 to 5 min. However, when the temperature is higher than 1000 ℃, the duration must be kept to lower than 1 min. Please contact with the engineer for special process. • The rate range is 1 to 200 (℃/sec)，but it is difficult to achieve a ramping rate lower than 50 (℃/sec) or higher than 150 (℃/sec). • Select Aux to set the temperature control parameter. Correct process parameter is important to get an appropriate temperature profile. • Temperature control parameters : • T-SW: The “Time Switch” field is used to program the temperature between ramp-up and steady-state temperature. (0 ~ 500℃)

5. Gain, DGain: They assists in achieving a desired temperature profile by eliminating overshoot, undershoot, and oscillations. (0 ~ -500) • IWarm: The first steady state value used to process the previous wafer. (0 ~ 99.99%) • ICold: The initial intensity to process the wafer. (0 ~ 99.99%) • Temperature-profile optimization guidelines • Overshoot : T-SW ↑ • •Gain ↑ • •DGain ↑ • •I-Cold ↓ • Undershoot : T-SW ↓ • •Gain ↓ • •DGain ↓ • •I-Cold ↑ • Oscillation : Gain ↑ • •DGain ↑ • Second undershoot : Gain ↓ •I-Cold ↓

6. 4.Loading wafer • Select “manual” in the main menu and unlock the door. • Pull out the chamber door and then put the wafer on the quartz pin. • Close the door and lock it. • Caution： • –Quartz pin is brittle, please be careful to put on the wafer • –Only silicon substrate is allowed. Metal coated wafer if forbidden. • –The sample need to be pre-cleaned before putting into the chamber. • –Please contact with supervisor for special substrate or process.

7. 5.Processing • elect “Process” in the main menu and select Run to start processing. • Select Plot to enter the window. It shows the Temperature profile immediately. • It needs more care during ramping process condition. • Whenever emergency occurs, select Abort to stop process.

8. 6.End process • When the process terminated, an alarm message appeared. • Exit the “Plot” window. • Select “Alarm” to enter it • Select Clear to delete the message • If there are to many alarm messages, press log twice to delete all the messages. • Select exit to leave this window

9. 7.Unloading wafer • Wait for 3~5min, after the process completed. • Select “manual” in the main menu to close the cooling gas. • Unlock the door to do next process. • If all the process is finished, close the door and lock it

10. 8.Turn off the system • Check to see if all the valves are in the normal condition. • Check to see if the door is locked. • Press “F10” to leave the control software. • User utility permit & personal password to turn off the system. • Please clearly record the process & status of experiment.