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Architetture e Tecnologie per Terminali Wireless

Architetture e Tecnologie per Terminali Wireless. (Chip-set Commerciali). Panoramica di chipset commerciali. Architettura supereterodina Architettura Low-IF . Architettura Supereterodina. Architettura Low-IF. Multibanda multistandard. Bluetooth.

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Architetture e Tecnologie per Terminali Wireless

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  1. Architetture e Tecnologie per Terminali Wireless (Chip-set Commerciali)

  2. Panoramica di chipset commerciali • Architettura supereterodina • Architettura Low-IF

  3. Architettura Supereterodina

  4. Architettura Low-IF

  5. Multibanda multistandard

  6. Bluetooth

  7. Progetto di un front-end per cellulari GSM Dual-Band • Specifiche • Cifra di rumore complessiva: NFTOT  10dB • Guadagno complessivo in ricezione: GMAX  80dB, GMIN 30dB • Punto di compressione a 1dB: CPI1dB -20dBm • Intercetta del terzo ordine: IP3I -15dBm • Reiezione immagine: IR  30dB • Attenuazione canali adiacenti:   15dB @ f=200kHz • Potenza di trasmissione: PMAX 30dBm (EGSM), PMAX 28dBm (DCS) • Livello delle armoniche in uscita: 2f0 , 3f0  -50dBc • Densità rumore fuori banda: NOISE -100dBc/Hz @ f  400kHz

  8. Chipset Tranceiver UAA3535HL Power Amplifier CGY2014TT PA Controller PCF5078 Altri dispositivi Antenna LDA42D Diplexer/ Switchplexer LMC36-07A0505A Filtro Rx SAF942.5T1842.5ML80T VCO MQE921-1840 MQE9PD-897 MQE9PF-1747 Dispositivi utilizzati per il progetto • Accoppiatori direzionali LDC15D190A0008 • Isolatori CE073R897DCB CE0521R74DC • Balun LDB20C500A0900 LDB15C101A1800 LDB15C500A1900 • TCXO TC2268FN13000

  9. Schema a blocchi del progetto

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