1 / 20

Scaling of MOS circuits

Scaling of MOS circuits. ( Pucknell p: - 113-133). What is Scaling? Proportional adjustment of the dimensions of an electronic device while maintaining the electrical properties of the device. Impact of scaling is characterized in terms of several indicators: Minimum feature size

hoang
Download Presentation

Scaling of MOS circuits

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript


  1. Scaling of MOS circuits (Pucknell p:- 113-133)

  2. What is Scaling? • Proportional adjustment of the dimensions of an electronic device while maintaining the electrical properties of the device

  3. Impact of scaling is characterized in terms of several indicators: • Minimum feature size • Number of gates on one chip • Power dissipation • Maximum operational frequency • Die size • Production cost

  4. Scaling Models • Full Scaling (Constant Electrical Field) • Ideal model – dimensions and voltage scale together by the same scale factor • Fixed Voltage Scaling • Most common model until recently – only the dimensions scale, voltages remain constant • General Scaling • Most realistic for today’s situation – voltages and dimensions scale with different factors

  5. Scaling Factors for Device Parameters • Device scaling modeled in terms of generic scaling factors: 1/α and 1/β • 1/ β : scaling factor for supply voltage VDD and gate oxide thickness D • 1/α: linear dimensions both horizontal and vertical dimensions

  6. Gate area Ag Where L: Channel length and W: Channel width and both are scaled by 1/α • Thus Ag is scaled up by 1/α2

  7. Gate capacitance per unit area Co or Cox Where εox is permittivity of gate oxide(thin-ox)= εins εo and D is the gate oxide thickness scaled by 1/ β • Thus Cox is scaled up by

  8. Gate capacitance Cg Thus Cg is scaled up by β * 1/α2 = β/α2 • Parasitic capacitance Cx • Cx is proportional to Ax/d where d is the depletion width around source or drain and scaled by 1/ α Ax is the area of the depletion region around source or drain, scaled by (1/α2 ). • Thus Cx is scaled up by

  9. Carrier density in channel Qon • where Qon is the average charge per unit area in the ‘on’ state. • Co is scaled by β and Vgs is scaled by 1/β • Thus Qon is scaled by 1

  10. Channel Resistance Ron • Where μ = channel carrier mobility and assumed constant • Thus Ron is scaled by 1

  11. Gate delay Td • Td is proportional to Ron*Cg • Td is scaled by

  12. Maximum operating frequency fo • fo is inversely proportional to delay Td and is scaled by

  13. Saturation current Idss • Both Vgs and Vt are scaled by (1/β). Therefore, Idss is scaled by

  14. Current density, J= Idss/A • where A is cross sectional area of the • Channel in the “on” state which is scaled by (1/ α 2) • So, J is scaled by

  15. Switching energy per gate Eg • So Eg is scaled by

  16. Power dissipation per gate Pg • Pg comprises of two components: static component Pgs and dynamic component Pgd: Where, the static power component is given by: And the dynamic component by: Since VDD scales by (1/ β) and Ron scales by 1, Pgs scales by (1/ β2). Since Eg scales by (1/ α2β ) and fo by (α2 / β), Pgd also scales by (1/ β2). Therefore, Pg scales by (1/ β2).

  17. Power dissipation per unit area Pa

  18. Power – speed product PT

More Related