Circular Track CRAMS Test Plan

1. Circular Track CRAMS Test Plan • System Level Reliability Goal 500 hrs MTBF @ 80% CL •  CT CRAMS goal of 35,040 hrs of MTBF • CT MCBF = 60 WPH X 35,040 hrs X 92%(availability) = 1,934,208 wafer cycle • Source of CRAMS wafer cycle • CMP803: 301,577 Cycles from March 13 to May 14 Assuming 10 hours overnight, 7 days a week • CRAMS Test Stand: 1,632,651 cycles [Modification to existing test stand needed] • Module Test stand Standalone Thruput (6 carriages) • Accelerated Sweep speed : 40 sweeps/min • Accelerated Module wafer time = (20/40)*40sec = 20 sec • Overhead: 3 second transfer time between cycles • Fixture Module wafer time= 20sec + 3 sec = 23 sec • 6 carriage in Fixture (vs 4 carriage) • Fixture thruput = 1/23x3600x1.5= 234.8 WPH • Fixture hour = 1,632,651/234.8 = 6,954 hrs = 290 days • CT CRAMS Test Stand MTBF requirement: 290 daysfrom June 13 to April 14.

2. Challenges for CT • Assumption of running system 803 for 10 hours a day, 7 days per week for 14 months • Test stand availability • New encoder for test stand • Resource to update test stands to start cycling by June- Lead time of parts

3. Challenges for HCLU • Assumption of running system 803 for 10 hours a day, 7 days per week for 14 months • Test stand availability • New parts for test stand • Resource to update test stands to start cycling by June- Lead time of parts for modules • Software? • New HCLU

4. HCLU CRAMS Test Plan • CRAMS goal of 35,040 hrs of MTBF • Module throughput = 60 WPH/2 Loadcup = 30 WPH • Per Loadcup MCBF=30 WPH X 35,040 hrs X 92%=967,104 wafer cycle • Source of CRAMS wafer cycle • CMP803: 301,577 Cycles from March 13 to May 14 • CRAMS Test Stand: 665,547 cycles. • Estimate Fixture throughput: 180 wafer/hr (Assuming 20 sec/wafer) • Loadcup Fixture MTBF reqt= 665,547 /180 = 3,697 hrs = 154 days • CT CRAMS Test Stand MTBF requirement: 154 daysfrom June 13 to Dec 13

5. Pad Conditioner CRAMS Test Plan • Pad Conditioner CRAMS goal: 35,040 hrs of MTBF • Per PC thruput = 60/4*2= 30 WPH • Per PC MCBF = 30 WPH X 35,040 X 92% = 967,104 wafer cycle • Source of CRAMS wafer cycle • CMP803: 301,577 Cycles from March 13 to May 14 • CRAMS Test Stand: 665,547 cycles • Module Standalone Thruput • Module wafer time in thruput recipe(2x2): 40 sec • Fixture Thruput = 1/40*3600 = 90 WPH • Fixture MTBF requirement = 665,547/90 = 7,395 hrs = 308 days • PC CRAMS Test Stand MTBF requirement: 308 days from June 13 to May 14

6. Challenges for Pad Conditioner • Assumption of running system 803 for 10 hours a day, 7 days per week for 14 months • Test stand availability • None • New Pad Conditioner Assembly

7. Platen Assembly CRAMS Test Plan • CRAMS goal of 35,040 hrs of MTBF   • Throughput per Platen = 60/4x2 = 30 WPH • Per Platen MCBF = 30 WPH X 52,560 hrs X 92% = 1,450,656 wafer cycle • Source of CRAMS wafer cycle • CMP803: 301,577 Cycles from March 13 to May 14 • CRAMS Test Stand: 1,149,099 cycles. • Module Standalone Thruput • Module wafer time in thruput recipe(2x2): 40 sec • Throughput per polish = 1/40 = .025 (wafer/sec) • BKM rotation speeds : 100 RPM • Accelerated Sweep speed : 150 RPM • Accelerated Module wafer time = (100/150)*40sec = 26.67 sec • Fixture thruput = 1/26.67x3600= 135 WPH • Fixture MTBF requirement = 1,149,099/135 = 8,513 hrs = 355 days • Platen Assy CRAMS Test Stand MTBF requirement: 355 days from June 13 to June14

8. Challenges for Platen Assembly • Assumption of running system 803 for 10 hours a day, 7 days per week for 14 months • Test stand availability • None • Possible CRAMS at supplier. Need support from CBM • New Platen Assembly

9. VDM