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VINNOVA Excellence Center Ubiquitous Intelligence in Paper and Package Short Introduction

VINNOVA Excellence Center Ubiquitous Intelligence in Paper and Package Short Introduction. Vision. The Vinnova Excellent Center on Ubiquitous Intelligence in Paper and Packaging ( VINNEX iPack ) is

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VINNOVA Excellence Center Ubiquitous Intelligence in Paper and Package Short Introduction

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  1. VINNOVA Excellence CenterUbiquitous Intelligence in Paper and PackageShort Introduction

  2. Vision The Vinnova Excellent Center on Ubiquitous Intelligence in Paper and Packaging (VINNEX iPack) is • A national hub of multidisciplinary collaboration for Researchers respectively from Swedish Forest Product Industry, Electronics Industry, and Bio-medical Industry; jointly develop core competence and technologies towards smart paper and packaging. • For example, integrating smart chips or bio-medical sensors, energy and battery cells, and wireless links/RFID on paper substrate, for applications such as Intelligent Food & Pharmaceutical Packaging, Wearable Wireless Sensors and Intelligent Monitoring Devices for Healthcare, dissolvable smart dusts for security & bio-defense. • The center will perform both long-term innovative projects on key enabling technologies as well as application-oriented prototyping projects; timely transfer IPs and know-how to its industrial partners. • The center is guided by the vision of Ubiquitous Intelligence – the next economic driving force after internet.

  3. Access Point or PHA Smart Chip Energy supply Existing ICT infrastructure Radio/ RFID Sensor interface Sensor Paper substrate System Concept and Application Examples Radio/RFID: ultra low cost (~a few cents), ultra low power (~uW) Energy supply: self-power via wireless charge, printable battery etc Sensors: Silicon MEMS based or paper-based bio- medical sensors Integration: printable antenna, printale sensors, low cost integration Applications: Smart Package, Healthcare, Home Security, Bio-Defense etc

  4. We bring the whole supply chain in one center ! Meet Multidisciplinary Industrial Partners Find Innovative Business Opportunities Smart Paper & Packaging Werable Bio-Medical Sensors & Bio-Paper Bio-defense, Green PCB market Niche Applications VINNEX Center System Integration & Technology Fusion Competence on Sensor & Battery Competence on Printing, Assembly, & Manufacturing Technologies Competence on RFID/Electronics Competence on Paper Board & Paper Surface Treatment

  5. Enabling Technologies Technology Paper and Surface Information visualize Sensor & micro-fluids Energy cells Radio & Antenna Signal Processing Assembly & Integration Application RFID Wireless sensor Intelligent packaging iLogistics Health care Home Security Bio-defense Extremely high relevance High relevance Relevance

  6. Research Methods • Specification of requirement (mechanical and chemical stability, surface and electrical properties) of paper board for electronics applications • Paper surface treatment (roughness, ink affinity, lateral diffusion etc) which enables high quality electronics printing and wet chemical process • Conductive (e.g. nano-silvers) film, polymers, semiconductors, and functional materials printing on paper using inkjet technologies and chemical vapor deposition, coating & each • Characterization of electrical and mechanical properties, exploring process limitations for mass production and manufacturability. Feed-back to paper fab and process • Passive components and sensor manufacturing and test, multi-layered structure and components testing • Integration of interconnected paper board with silicon chips and sensors for intelligent packaging (RFID/chip design should starts in parallel with paper board processing). Reliability and function test. • Production and manufacturability test for intelligent packaging, feed-back to paper board suppliers and process developers • Demonstration of intelligent paper and packaging (integrate the technologies from the whole supply chain)

  7. Industrial Contributions • Direct contributions (i.e. direct funding, donations of lab equipment and lab materials, host student internship, support of MPW chip, offer experimental materials and test, funding IPs/patents, scholarship to postdoc or Ph.D. researchers, industrial Ph.D. etc) • In kind contributions (soft-money): i.e. your personnel participating in projects, equipment, open research positions for visiting researchers, industry PhD candidates, access to facilities etc, industrial supervisors for Ph.D. students and exjobb students, join steering board

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