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Chipwrights – Modern IC Design

Chipwrights – Modern IC Design. Luis Diego Cabezas, Drew Harry, Sharon Talbot. Introduction Technical Information Design Fabrication Software Development Business Background Funding History Business Strategy Marketing Prospective Markets Value Added Cost Breakdown Maketing/Sales Team.

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Chipwrights – Modern IC Design

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  1. Chipwrights – Modern IC Design Luis Diego Cabezas, Drew Harry, Sharon Talbot

  2. Introduction • Technical Information • Design • Fabrication • Software Development • Business Background • Funding History • Business Strategy • Marketing • Prospective Markets • Value Added • Cost Breakdown • Maketing/Sales Team

  3. Design Differs from industry standards – • Optimizes parallel activities with 8 logic units • Basic components for video and audio – codec done in software, which allows for greater flexibility • Utilizes a “vector processing” method • Low power consumption

  4. Fabrication • Sent off to a “Foundry” – called a “Tape-out” • On return, the chip is analyzed. • If errors, some can be corrected on a surface level – Others must be returned to the company. • Entire process takes several months – a significant delay if many errors are found.

  5. Software Development Examples: • Compilers, linkers, debuggers (Software Development Kits). • Developing software building blocks for quick deployment. • Complete consumer application development. They currently are developing for several different companies as demo models – allows them to demonstrate the value of their product.

  6. Introduction • Technical Information • Design • Fabrication • Software Development • Business Background • Funding History • Business Strategy • Marketing • Prospective Markets • Value Added • Cost Breakdown • Maketing/Sales Team

  7. Venture Capital • 11/99-2/00 Seed funding: $250k, COMDEX • 5/00 Round A: $4.5M, valued at $8.5M • 11/00 COMDEX, first simulated chip • 9/01 first tape-out • 11/01 Round B: $8M, valued at $13.5M • 11/01 first silicon chip (hard times for industry) • 9/02 second silicon chip, for digital cameras • 3/03 Round C: $18M, valued at $33M • 5/03 third silicon chip, cost reduction • 11/03 volume production

  8. Business Strategy: Start-Up Phase • Market segment • High-performance, low-power, low-cost, multipurpose chips. On the bleeding edge of hardware • R&D • Chip design updated yearly, new applications sought • Transferable/compatible software development • Sales/Marketing • Aggressive seeking of customers (Tokyo, US, Europe) • Goal: several major camera manufacturers • Customer Relations • Close contact helps guide chip design • Technical support and documentation are paramount

  9. Introduction • Technical Information • Design • Fabrication • Software Development • Business Background • Funding History • Business Strategy • Marketing • Prospective Markets • Value Added • Cost Breakdown • Maketing/Sales Team

  10. Prospective Markets • 50-100 Possible Customers • Products with highly parallelizable tasks. • Low Cost, Low Power, “High” Speed • Growing segment with advent of distributed media applications (with low power consumption needs) • Cameras • Cellphones • iPod (+ video) • PDAs

  11. Value Added vs. Custom • Allows customers to focus on features not hardware • Software allows flexibility/upgrades – better to not hardcode features • Decreases development costs. Designing new silicon chips is very expensive. (~$2 million + 1 year @ 0.13 micron)

  12. Sample Breakdown of Costs • $200 retail price • $100 wholesale • $25 labor, other parts of camera • $75 chip cost • $65 other chips • $10 Chipwrights DSP • 50% margin on chip cost

  13. Marketing/Sales Team • Salesmen. Strategic level – who to go after and how • Field Application Engineers. Actual engineers who work with consumers to help with product development pre/post sale. • Operations. Production management and supply chain work. • Documentation. Website, product docs, marketing materials, etc. • About 20 People

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