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Chabot ENGR 45 AMAT Tour

Chabot ENGR 45 AMAT Tour. B85 Maydan Technology Center . Nic Celeste SRP Chamber Engineering. 30 September 2013. Contents. General Rules Introduction Nic Celeste How does ENGR 45 relate to my job? About Applied Materials Clean Room Safety Gowning Hazards Emergency Protocol Tour.

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Chabot ENGR 45 AMAT Tour

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  1. Chabot ENGR 45 AMAT Tour B85 Maydan Technology Center Nic Celeste SRP Chamber Engineering 30 September 2013

  2. Contents • General Rules • Introduction • Nic Celeste • How does ENGR 45 relate to my job? • About Applied Materials • Clean Room Safety • Gowning • Hazards • Emergency Protocol • Tour

  3. General Rules: • NO PHOTOGRAPHY- • Keep your Phones away. • Visitor badges on at all times. • Be Respectful- • This is a real lab, people are here trying to do their job. • Don’t Touch- • This is a research lab. The equipment is dangerous, and things are expensive. • Be alert- • This is a big group, don’t be in the way of people trying to work. • There are many potential hazards in the lab. • Pay attention to where you are and what is moving around you. • Ask Questions!

  4. Introduction

  5. Introduction • Nic Celeste, EIT nicholas_celeste@amat.com • Mechanical Engineer • Selective Removal Products • R&D Hardware engineer: I solve hardware problems and design parts for a Plasma CVD machine that etches silicon wafers. • Really cool stuff I get to do: • Build brand new parts & machines that have never existed before • Work with sophisticated tools and brilliant people • Shape the future of material technology • San Francisco State Graduate, BS ME 2012 • Transfer from Chabot/ Las Positas 2004-2010 • Thermal/Fluids Emphasis at SF State • Background in Welding, Fabrication, Quality Control, Assistive Mobility technology, Automotive & Construction (Electrical)

  6. How does ENGR 45 relate to my job? • Every problem that we solve is related to materials. • Particularly their Electrical, Chemical, Thermal, & Mechanical properties. • The tool I work on removes silicon by creating and removing oxides. • Our main Mechanical Engineering challenges: • Uniformity & Particles • Uniformity: • Our process is thermally sensitive. • Parts need to transfer heat to maintain thermal uniformity across the wafer. • Particles: • Our parts cannot corrode or sputter in the chamber. • We must design with materials that react predictably with our process chemistry and plasma.

  7. About Applied Materials Slides From “Corporate Overview” Presentation

  8. WHAT WE DOWe make the equipmentthat makes the components that change the world. Corporate Overview – Data as of Q3 FY13

  9. Top 10 Worldwide Semiconductor Equipment Manufacturers * Includes service and spares. flat panel display equipment not included. Source: Gartner ( Published annually in April) Semi Industry Status – Data as of Q3 FY13

  10. Applied’s Technology Enabling Tablet PC Display Enabled by AppliedMaterials’PE-CVD, PVD, test,and Roll-to-Roll equipment(>30% of tablet BOM*) LCD display 9.7” LED backlit panel Touch panel capacitive multitouch Semiconductor Enabled by Applied Materials’Silicon Systemsequipment - microprocessor 256MB DRAM 16GB MLC NAND Flash I/O controller multi-touch controller (>20% of tablet BOM*) Source: iFixit, UBS, Applied Materials * Refers to % of Bill of Materials processed by Applied Materials equipment Corporate Overview – Data as of Q3 FY13

  11. Enabling and Accelerating Innovation Applied Materialsis theglobal leader in providing manufacturing solutions for the semiconductor, flat panel display and solar photovoltaic industries • OUR STRENGTHS • Precision materials engineering • Commercializing sophisticated systems • Global reach Corporate Overview – Data as of Q3 FY13

  12. R&D Investment • FOR THE PAST DECADE, • ~$1Billion invested annually in RD&E Corporate Overview – Data as of Q3 FY13

  13. The Most Exciting Industries on Earth Semiconductor Display Solar 20,000,000x 20x 5x reduction in COST PER TRANSISTOR in 30 years1 reduction in COST PER AREA in 15 years2 reduction in COST PER WATT in 4 years3 In 1976, a 32GB smartphone would have cost more than 4 BILLION DOLLARS 1 Source: SIA, IC Knowledge LLC 2 Source: Display Search, Nikkei BP, Applied Materials 3 Source: Photon Consulting 2012 Corporate Overview – Data as of Q3 FY13

  14. Enabling Mobility Age More Transistors New Architectures Performance atLow Power Moore’s Law Scaling 3DTransistors Mobile EndMarkets Corporate Overview – Data as of Q3 FY13

  15. Business Segments Silicon Systems Group Display Energy and Environmental Solutions Applied Global Services Corporate Overview – Data as of Q3 FY13

  16. Silicon Systems Group • Aglobal leader in the manufacture of advanced semiconductor equipment • Applied equipment is enabling the key advancements in semiconductor processing technology that make tomorrow’s devices possible. • With unmatched expertise in precision materials engineering, we help our customers address consumer demand for higher performance and lower power consumption solutions. Global expansion of the consumer base is driving demand for mobile PCs, smart phones and other types of consumer electronics Corporate Overview – Data as of Q3 FY13

  17. Display World class TFT-LCD* equipment and services Extending core equipment technology into new mobility and other high-performance Display segments The equipment we build uses scale to help make flat panel TVs more than 20% larger each year without price increase Exploring emerging display technologies, such as touch panel, flexible substrate and OLED which will drive the future of the screen * Thin film transistor – liquid crystal display Corporate Overview – Data as of Q3 FY13

  18. Energy and Environmental Solutions Powering the c-Si Roadmap Driving technology & innovation to solve today’s photovoltaic (PV) manufacturing challenges Delivering advanced wafering and integrated cell manufacturing equipment Continually improving cell efficiency while lowering manufacturing costs Accelerating global PV adoption by delivering cost-effective solutions that integrate technology, equipment and materials to increase cell efficiency, improve factory productivity and lower operating costs. Corporate Overview – Data as of Q3 FY13

  19. Applied Global Services • Collaborate with customers to predict and solve problems. Improve equipment and fab productivity. • Broad, flexible portfolio for custom solutions • Advanced predictive and diagnostic technologies • Innovative technology extension and conversion • World-class expertise and knowledge-base systems Optimizing efficiency of semiconductor, display and solar factories through integrated services, spares, equipment and automation software. Corporate Overview – Data as of Q3 FY13

  20. Clean Room Safety

  21. BASIC CONTAMINATION CONTROL Contamination is: A foreign substance that has a detrimental effect on products or processes.

  22. BASIC CONTAMINATION CONTROL RELATIVE SIZES WIDTH OF A HUMAN HAIR 60 microns SMALLEST VISIBLE PARTICLE (20 MICRONS) BLOOD CELL (7 MICRONS) 1 MICRON CONTAMINANTE 60 1 7 10 20 30 40 50 MICRON SCALE

  23. BASIC CONTAMINATION CONTROL SKIN FLAKE EXAMPLE Skin Flake Defect - 1 micron line width

  24. CLASS 10,000 CLASS 1,000 CLASS 100 CLASS 10 CLASS 1 BASIC CONTAMINATION CONTROL CLEAN ROOM CLASIFICATIONS PARTICLES PER CUBIC FOOT AT 0.5 MICRON With the improvement of clean room technology and design these standards will have to be upgraded.

  25. Clean Room Safety • Once we leave this room we will head up to the Clean Room • Gowning- • I will demonstrate proper Gowning for the clean room upstairs. • Room 1: • Shoe Covers • Hair Net • Face Mask/ Beard Cover • Gloves • Room 2: • Gown Head to Toe: • Head Cover • Coveralls • Boots • Safety Glasses. • IN CASE OF EMERGENCY: DO NOT DEGOWN. EXIT PROMPTLY

  26. Let’s Start The Tour!

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