'Wire delay' presentation slideshows

Topologies - II

Topologies - II. Overview. Express Cubes Flattened Butterfly Fat Trees DragonFly. Express Cubes. The Problem Node delay dominates wire delay Pin densities are not as high as wiring densities In a k- ary n- cube , n , k , and W are all related

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Wires & wire delay

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Lecture 16

Lecture 16. Introduction to Integrated Circuit Design C ourse summary. Designing gates with switches. Already the first lecture we learnt how to design gates with switches a nd in CMOS there are two complementary switches. VDD. P -switch. P -switch. N-switch. pMOS pull- up network.

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EECS 150 - Components and Design Techniques for Digital Systems Lec 14 - Timing

EECS 150 - Components and Design Techniques for Digital Systems Lec 14 - Timing . David Culler Electrical Engineering and Computer Sciences University of California, Berkeley http://www.eecs.berkeley.edu/~culler http://www-inst.eecs.berkeley.edu/~cs150. Outline.

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CS 7810 Lecture 2

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Wire Efficient Topology

Wire Efficient Topology. In the 3D world. For n nodes, bisection area is O(n 2/3 ) For large n, bisection bandwidth is limited to O(n 2/3 ) Bill Dally, IEEE TPDS, [Dal90a] For fixed bisection bandwidth, low-dimensional k-ary n-cubes are better (otherwise higher is better)

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Lecture #25a

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(cag.lcs.mit/~mtaylor)

The Raw Processor: A Scalable 32 bit Fabric for General Purpose and Embedded Computing Presented at Hotchips 13 On August 21, 2001 by Michael Bedford Taylor. (http://cag.lcs.mit.edu/~mtaylor). The Raw Processor. Michael Taylor , Jason Kim, Jason Miller,

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LRU-PEA: A Smart Replacement Policy for NUCA caches on Chip Multiprocessors

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EE 587 SoC Design & Test

EE 587 SoC Design & Test. Partha Pande School of EECS Washington State University pande@eecs.wsu.edu. SoC Physical Design Issues. Design Challenges. Non-scalable global wire delay Moving signals across a large die within one clock cycle is not possible.

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EE434 ASIC & Digital Systems

EE434 ASIC & Digital Systems. Jacob Murray School of EECS Washington State University jmurray@eecs.wsu.edu. Lecture 11 Physical Design Issues. Interconnect Scaling Effects. Dense multilayer metal increases coupling capacitance Older Assumption Deep sub-micron

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Performance Analysis of NUCA Policies for CMPs Using Parsec v2.0 Benchmark Suite

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Last Bank: Dealing with Address Reuse in Non-Uniform Cache Architecture for CMPs

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Amalgam: a Reconfigurable Processor for Future Fabrication Processes

Amalgam: a Reconfigurable Processor for Future Fabrication Processes. Nicholas P. Carter University of Illinois at Urbana-Champaign. Performance = f(architecture, implementation). LD. LD. ADD. MUL. LD. MUL. ST. LD. MUL. ST. LD. ADD. MUL. LD. MUL. ST. ST. LD. LD. ADD. MUL.

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The Raw Architecture Signal Processing on a Scalable Composable Computation Fabric

The Raw Architecture Signal Processing on a Scalable Composable Computation Fabric.

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Wang-Ping Lee, Hung-Yi Liu, and Yao-Wen Chang Department of Electrical Engineering, NTU ICCAD 2007

An ILP Algorithm for Post-Floorplanning Voltage-Island Generation Considering Power-Network Planning. Wang-Ping Lee, Hung-Yi Liu, and Yao-Wen Chang Department of Electrical Engineering, NTU ICCAD 2007. Outline. Introduction Problem Formulation Algorithm Experimental Results Conclusions.

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CS 7810 Lecture 15

CS 7810 Lecture 15. A Case for Thermal-Aware Floorplanning at the Microarchitectural Level K. Sankaranarayanan, S. Velusamy, M. Stan, K. Skadron Journal of ILP, October 2005. Importance of Temperature. High power density ? cooling tech must improve

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