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Procedure of Proactively Designing Products by Design for Manufacturability (DFM)

Design for manufacturability (DFM) is the procedure of proactively designing products to improve all the manufacturing features: fabrication, assembly, test, procurement, shipping, delivery, service, and repair, and guarantee the most effective cost, quality, reliability, regulatory compliance, safety, time-to-market, and client fulfillment. VayoInfo provide the best design for manufacturability, check out VayoInfo design for manufacturing at http://www.vayoinfo.com/<br>

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Procedure of Proactively Designing Products by Design for Manufacturability (DFM)

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  1. DFM Expert Intelligent DFx analysis intelligent software, pleasant work www.vayoinfo.com

  2. It happens around us whatever you notice or not On year 2013, Hitachi elevator free fall due to defected board in China, a lady was injured in this event. On year 2013, GM recall 380,000 vehicles due to defected engine control board. Due to abnormal behavior of PCBA, Taiwan high speed train lost power on year 2013. Major reason of AirAsia QZ8501 crash on year 2014 is a cracked solder joint on PCBA. On year 2013, Chrysler recalled >470,000 vehicles due to defected board. On year 2014, Mitsubishi recall 115,000 cars due to defect board of light switch.

  3. Are you always willing to stay with those issues? No thermal consideration, leads to cold solder, impact solder strength  Quality/reliability defects Silkscreen cross brings build and rework risk Stage Defects Remark >30% PCB design comes with problem. No thermal consideration Annual ring small Silkscreen error Silkscreen incomplete … • • • • Design • Tombstone Bridge Nonwetting >60% defects could be found prior to build Short Open Tombstone Cold solder Void … • • • • • • Void Manufacturi ng Repair rate for consumer product: 5%~37% in initial 3 years Solder joint crack Solder joint peeloff … • • • Via is too close to parts, it leads to poor solder joint, impact solder joint strength Crack risk Post-sales IPC research: 80% defects could be found and resolved at NPI stage.

  4. Change from DFx Past Today Yesterday Vayo customer solved this issue. They may still happen at your side. Above issues puzzles most of us. Ex.: Venture/SurfaceArt/Sierra/Sandisk… Vayo DFx software help you detect defects from the initial beginning.

  5. Company introduction  Founded on Jan of 2005, headquarter in China/Shanghai;  Dedicates to intelligent NPI software to accelerate design to manufacturing;  Fully in-house development, owns copyrights and patents;  Product installed >20 countries and regions worldwide;  Strategy partnership with equipment and EDA provider: Keysight/ViTrox/TRI/Fuji/Panasonic/Altium… >10 years dedication on NPI technology brings up the world-class product.

  6. Customer reference  Vayo software products installed in >20 countries and regions world wide (China/USA/Mexico/Japan/Singapore/Malaysia/Thailand/Vietnam/Philippine/Russia/India/Germany/UK/Romania/Spain/Taiwan/…) Telecom & network Automotive/ parts Energy/ Consumer Contract manufacturer Others Partner Computer Security/Medical

  7. Customer Testimonials “Vayo tool is a very intuitive and user-friendly. You can match parts and pds visually and new pd can be created easily. Part Data Editor and Parts Verification ensure every location has correct part, size and orientation.” “We started with Vayo at year 2009 and has not been turning back since then. What differentiate Vayo from the rest is their willingness to listen to customer’s needs with fast respond.” “Vayo tool has been extremely useful for us in identifying assembly issues much ahead of the actual assembly process. This has drastically reduced holdups in the production line, increasing our productivity.” “From years of experience with DFT and CAD SW's, VayoPro-Test Expert is the best. It is fast, accurate and easy to use. Its DFT report is very comprehensible for our customers.” “We have been impressed with the product capabilities, their communication and commitment to supporting their products is truly world class.” “I was impressed by Vayo NPI tool, it is really world class solution in the industry!“ Kent Kim Vice President Murad Kurwa Senior Vice President Eddie Chang SMT engineer David Kim Atar Mittal General manager CHIA Kar Lin Head of Innovation Centre Test Development Manager “From the selection of Vayo solution on the year of 2007, we are able to support these data source whatever we receives what kind of data from new customer, and then quickly complete placement programming. ” ”by introducing Vayo‘s intelligent software tool it is now possible for operators to perform data conversion requiring little skill, while reducing the work time required to a fifth of what it was.” Mitsuo Imai General manager “ Accelerator allowed us to reduce a lot the quantity of mistakes in the projects and the time required for their preparation. “ “With VayoPro-Test Expert solution and great support of Vayo team, we could accelerate our product review for DFT (ICT/Boundary).” “The accelerator function could help us a lot on component placement orientation, we don't need to do mapping Gerber file and check placement orientation one by one any more.” “Communication is important for every filed, good conversation shall bring joyful experience, Vayo is such company we worked with!” Sergei Fedorov Product Director Mohamad Azlan Ahmad, GPEO-M PE, Tong Chang Tony Zhou CC Cho Production Associate Manager CEO, IPC board director Sr. Manufacturing Engineer

  8. Core product: Intelligent NPI software for PCBA Reduce design & mfg cycle: 30%-70% Reduce quality defects: 30%+ Increase reliability: 30%+ Increase design and mfg efficiency: 40%+ Reduce design and mfg cost: 20% +      Intelligent DFx analysis DFM Expert & DRC+ PCB layout Eng., process Eng. NPI Eng. Process Eng., Industry Eng. Debug tech, others… Testing Eng. SMT programmer Document Expert SMT Expert/ Accelerator Other NPI sw Test Expert Fast placement programming, support Fuji, Panasonic, ASM, Juki, Yamaha… Board troubleshooting, Gerber conversion, assembly drawing, NPI team collaboration DFT/Testability, ICT/FP/AXI/AOI programming Work instruction document preparation * NPI:New Product Introduction

  9. DFx is must capability for every electronics company

  10. Why DFx: predict/solve process issue IPC research: 80% defects could be found and resolved at NPI stage.  Predict defect opportunity, increase manufacturing quality and reduce cost With DFx consideration: Increase process difficulty & steps; rapid solder/assembly defects; increase rework rate and work loading; lower work efficiency and increase manufacturing cost

  11. Why DFx: Improve product reliability Medical/automotive/military/aerospace/… product require high reliability  Improve reliability, reduce repair rate, protect brand reputation. Increase PCBA lifecycle Stability of consumer electronics products impacts brand loyalty and service cost. DFM Expert performs comprehensive checks on solder joints to ensure high reliability.

  12. Why DFx: reduce design cycle Product design challenge  Concurrent engineering, reduce prototyping times, shorten time-to- market Fast product replacement High density, smaller Difficult to transfer knowledge & training Concurrent design process new people

  13. DFM Automation Software  Traditional manual method Check one by one manual  No DFM software Can’t do comprehensive check Low work efficiency, long cycle  (Manual check > 2 weeks)  Invisible report for communication  Long cycle (time to market)   DFM automation software theory Based on design data, interacts with entity parts library, respects to rich industry standard to design & manufacturing, intelligent simulate/analysis prior to manufacturing, find out defects & risk of design at the first time  DFM Expert software  Comprehensive check of PCB  Quick to final result  Cover design, fabrication, assembly  Improve DFM capability quickly Save With Vayo Professional DFM analysis software

  14. Practical Rules PCB Fabrication Check PCB Assembly Check Component Library Validate Signal Validate Drill Validate Solder  mask/Silkscreen... Standard IPC rules Industry Experience Configurable Validate footprint/pad Validate spacing/distance Validate soldering … BOM Analysis Comprehensive library Quick manual create Detailed parts info. Result Query & reports Internal validation BOM&CAD Validation Support alternative part CAD/Gerber Source Interactive check Easy to share Powerful/Configurable DFM Expert Design for Manufacturing Analysis Support all CAD Gerber/Drill import Comprehensive, Automatic, Easy

  15. DFM Expert Scope: PCB Fabrication  Check rules: 300 items  Check content  Signal layer  Silkscreen layer  Solder mask layer  Solder paste layer  Drill …

  16. DFM Expert Scope: PCB Assembly  Checking rules: 900 items  Check content  Screen printing process  Placement process  Reflow process  Manual insert process  Wave soldering process  Test & inspection  Rework …

  17. DFM Expert Workflow 3. Link part library, virtual assembled boards 5. Interactive results query 1. Import PCB data (CAD/Gerber) 6. Select critical issues for report output 2. Import material info. (BOM/AVL) 4. Perform analysis with thousands rule

  18. Support CAD data source  Support all existing PCB CAD, intelligent detect file type CAD (File name) CAD (File name) No No 1 Accel (*.pcb) 14 Mentor (Neutral) 2 Cadence Allegro (*.val, *.cad) 15 DB++ (*.tgz) 3 Cadence Allegro (*.brd) 16 ODBxml (*.xml) 4 Cadence Allegro (*.fil,*.fim) 17 OrCAD (*.min 5 CR3000 (*.BSF, *.CCF, …) 18 ODBGateway (*.odb) 6 CR5000 (*.ftf, *.pcf) 19 PCAD (*.pdf) 7 Docica (*.docica) 20 PowerPCB/PADS (*.asc) 8 Fatf (*.asc) 21 Protel (*.pcb) 9 Gencad (*.cad, *.gen) 22 Protel3/Altium (*.pcbdoc) 10 Gencam (*.gcm) 23 TopCAD (*.txf) 11 HPLink (*.plk) 24 Unidat(*.uni) 12 HP_EGS (*.df) 25 Viscadif (*.paf) 13 IPC356 (*.ipc)  Support XY data + Gerber source

  19. Automatic BOM Import & Validation Support multiple BOM Formats  Excel, Text BOM .Vs. CAD Validation Mismatch parts quantity  Duplicate part number  In BOM not in CAD …  Minimize human interfere errors  BOM Comparison Save >70% manipulation cycle

  20. Rich Component Entity Library  Under SQL Database  Actual geometry/dimension data of part body enables the possible for virtual PCBA Based on datasheet  Support multiple shape (Rectangle/Circle…)  Multi-layers body  Detailed pin info. (Shape, size, direction, location, …) 2D & 3D View  Fastest part creation approach among the industry Intelligent capture info. from CAD

  21. Practical Checking Rule Support IPC standard  IPC-7351  IPC-A-600  IPC-A-610  IPC-TM-650  IPC-2221  IPC 7095 … Vayo experience rules  Thousands checking rules  Configurable parameter  Rule customization service  Customer internal guideline conversion service

  22. Interactive Result Query  Interactive query  Snapshot defects  Add remark/comments  Colorful warning level

  23. Result Report Export  Comprehensive Content • Defect Level • Defect Name • Rule Info. • Actual Value • Picture • Locations • Layer/Side Info. • ……  Export Report • Excel, PDF, … • Customization service

  24. Sample DFx issue: material not match PAD design Impact • Stop production, waste product line resource • Delay shipment & go-to- market Package not match Package not match Package not match Missing via, small copper size

  25. Sample DFx issue: components too close Impact: Require high precise equipment • Risk of assembly conflict • Difficult to rework •

  26. Sample DFx issue: Via distance to pad Impact: More via on boards, it shall be more easy to bring short, bridge, and insufficient solder issues. Good design

  27. Sample DFx issue: annual ring design Annual ring too small, even missing Via offset to pad Impact: Easy to cause weak structure; lead to crack/ broke & malfunction in severe usage conditions.

  28. Sample DFx issue: risk for via under component Impact: May cause bridge/short when PCBA goes through wave process.

  29. Sample DFx issue: Via under BGA pad Impact: via in BGA pad, it might lead to weak solder joint strength because of void. It shall impact product reliability.

  30. Sample DFx issue: BGA pad design Solder mask defined pad, it shall easily cause the root of solder joint crack especially in frequently shock environment.

  31. Sample DFx issue: no thermal consideration Good design Poor design Poor design Impact: It might cause tombstone if there is no thermal consideration. Or it might cause insufficient solder for PTH parts, and then impact solder joint strength and product reliability.

  32. Sample DFx issue: PTH part to mask strip Poor design Impact: PTH part approach mask strip too near, easily cause solder issue like short.

  33. Sample DFx issue: poor test point design TP size impact contact of probe, then impact faults reject rate of test.

  34. Sample DFx issue: poor silkscreen design No polarity mark Cross of part reference name Impact • Wrong polarity during assembly • Replace with wrong material during rework

  35. Sample DFx issue: no local fiducial for fine-pitch parts Impact Brings offset risk during assembly Good design

  36. Sample DFx issue: Orientation of part pass through oven Poor design Good design Impact: Part placement orientation shall be consistent with wave process, otherwise it may casue bridge.

  37. Sample DFx issue: BOM content error DFM Expert perform intelligent check of BOM content, report any quantity mismatch error. Impact: Component mismatch may leads material shortage for the work order, which leads to production stop, waste equipment resource; Or cause excessive material purchasing and extra inventory.

  38. Sample DFx issue: Alternative part analysis DFM Expert compare dimension between alternative part with primary part, and alter upon big size difference. Impact Big size difference between alternative part with primary part may cause assembly problem, solder joint defect or poor reliability.

  39. DFM Expert Function & feature 300 check items, cover potential risk in those layers (signal, silk screen, solder mask, …) & drill Fabrication DFM Analysis 900 check items, cover the process of screen printer, pick&place, reflow, manual insert, wave, testing, repair & etc Assembly Affordable DFM/DFA solution! Cadence Allegro/OrCAD, Mentor/PowerPCB/Pads, Altium/Protel, Zuken CR3000/CR5000, ODB++, GenCAD, … CAD Data source Gerber BOM Rev. comparison RS-274-D, RS-274-X Powerful parser, support varies dynamic content CAD rev. difference check, BOM difference check 200K parts and typical package free of charge, detail and actual component dimension Build-in library Parts library Creation tool Easy for parts/package creation Support IPC standard ( IPC-7351, IPC-A-610, IPC-2221, …), Vayo industry experience Flexible, configurable, support multiple library, access rights control Build-in rules Check rules Management Query Reports 3D view & output Interactive query, link to PCB location Results query, reports & output Export critical issue to Excel/PDF/Html formats 3D PCBA view, output DXF 3D data Part list Output material/parts data

  40. Business benefit  Reduce trial-run times: 2 ~ 3 times  Reduce quality defects: 5% ~ 10%  Reduce manufacturing cost: 2% ~ 5%  Reduce design cycle, time to market: 5% ~ 10%  Save labor cost (DFM analysis): 50% ~ 80%  Improve product stability  Leverage Design & Manufacturing capability

  41. Thanks! intelligent software, pleasant work www.vayoinfo.com

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