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RoHS Compliant & Green Components

RoHS Compliant & Green Components. Content. Environmentally Friendly Materials Drivers Legislation AMIS RoHS & Green Component Definition Hazardous Substances in Current Components Re-Flow Profile for Moisture Sensitivity Assessment Impact Pb-Free Solder on Package Construction

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RoHS Compliant & Green Components

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  1. RoHS Compliant &Green Components

  2. Content • Environmentally Friendly Materials Drivers • Legislation • AMIS RoHS & Green Component Definition • Hazardous Substances in Current Components • Re-Flow Profile for Moisture Sensitivity Assessment • Impact Pb-Free Solder on Package Construction • AMIS Changes in Bill of Assembly Materials • Qualification Stress Test Conditions • Product Marking and Labeling • AMIS RoHS-Green Qualification Status

  3. Environmentally Friendly Materials Drivers • RoHS Directive 2002/95/EC Effective July, 2006 • Lead Pb < 1000 ppm • Mercury Hg < 1000 ppm • Cadmium Cd < 100 ppm • Hexavalent Chromium Cr+6 < 1000 ppm • Polybrominated Biphenyl PBB < 1000 ppm • Polybrominated Diphenyl Ether PBDE < 1000 ppm • Market Pressure • Japanese Consumers Demand Green Components • New Designs for Consumer Products are all Green • High Temperature Applications • Solders Required for Harsh Environments • Automotive • Avionics • High Ambient Temperature Applications for well Defined Duration

  4. Worldwide Legislation RoHS(Restriction of Hazardous Substances) Pb, Hg, Cd, Cr+6 PBB & PBDE JGPSSI (Japan Green Procurement Survey Standard Initiative) Pb, Hg, Cd, Cr+6 PBB, PBDE, TBBP-A-bis Chlorinated Organic Compound PCB, PCN, CP, Mirex Organic Sn Compound Asbestos Azo Formaldehyde PVC & PVC Blends Situation of Banned Substances in the World • Different Definitions & Thresholds arebeing Debated in EU, Japan & US • Whether all Worldwide Brominated Substances or only Specified Types will be Banned is still Unclear

  5. Japanese Legislation • Japanese • The Japanese Ministry of Trade (MITI) Passed a Recycling Law for Electrical Appliances with Effect from April 2001 • This Suggests but does not Include Lead Phase-out Timetable • OEM's are Removing Lead from Electronics Mainly due to Market Pressures • The JGPSSI (Japan Green Procurement Survey Standard Initiative) is Followed by many OEM’s

  6. EU Legislation Applicable for: Large Household Appliances Small Household Appliances IT & Telecom Equipment Consumer Equipment Lighting Equipment Electrical & Electronic Tools Toys, Leisure & Sports Equipment Medical Equipment Systems Monitoring & Control Instruments Automatic Dispensers Who is Exempt: Medical Implanted &Injected Products Pb in Servers, Storage & Storage Systems until 2010 Large Stationary Industrial Tools Pb in High-End Manufacturing & Telecommunications Products Automotive, Aerospace, Military • Directive 2002/95/EC (RoHS) • Proposal for an Directive on Eco-Design of End-Use Equipment (EUP) that will havesome Regard to Hazardous Materials in Equipment

  7. United States Legislation • United States • Although a Number of States are Heading Towards Lead-Free and/or Recycling Regulation There is not yet a Published Federal Position • In September 2003 California Enacted an E-Waste Recycling Bill • The EPA (Environmental Protection Administration) has Proposed a Crack-down on Lead Emissions from Plants that may Impact the Soldering Industry

  8. AMIS RoHS & Green Definition • RoHS Compliant = AMIS Pb-Free • Pb < 1000 ppm • Hg < 1000 ppm • Cd < 100 ppm • Cr+6 < 1000 ppm • Polybrominated Biphenyl < 1000 ppm • Polybrominated Diphenyl Ether < 1000 ppm • Full Green = AMIS Green • All of the Above Requirements Plus • Bromine < 900 ppm • Chlorine < 900 ppm • Antimony < 900 ppm • Tributyltin Oxide Not Used • Phosphorus Not Used

  9. Hazardous Substances inCurrent Compounds DIE DIE DIE Laminated Package Leaded Package • Pb as Solder Plated Leads or Balls of Packages • Pb Content Solder Plated Leads: 0.1 – 0.3% by Weight • Pb Content Solder Balls of BGA Packages: 4.9% by Weight • Bromide &/or Antimonated Flame Retardant of Epoxy Molding Compound • Bromide Content: 0.2 – 1.8% by Weight • Antimony Content: 0.3 – 0.7% by Weight Solder Balls Solder Lead Finish

  10. Re-Flow Profile for Moisture Sensitivity Assessment IPC/JEDEC J-STD-020B AMIS Sn-Pb Eutectic Assembly Pb-Free Assembly Sn-Pb Eutectic Assembly Pb-Free Assembly Profile Feature Large Body Small Body Large Body Small Body Large Body Small Body Large Body Small Body Average ramp-up rate(TL to Tp) 3ºC/second Max. 3ºC/second Max. 3ºC/second Max. 3ºC/second Max. 100ºC150ºC60-120 Seconds 150ºC200ºC60-180 Seconds 100ºC150ºC60-120 Seconds 150ºC200ºC60-120 Seconds Preheat • Temperature Min. (Tsmin) • Temperature Max. (Tsmax) • Time (Min. to Max.)(ts) Tsmax to TL 3ºC/second Max. 1-2ºC/second Max. 1.5-2.5ºC/second Max. • Ramp-up Rate • Time Maintained Above: • Temperature (TL) • Time (tL) 183ºC60-150 Seconds 217ºC60-150 Seconds 183ºC60-150 Seconds 217ºC60-150 Seconds 225 +0/-5ºC 240 +0/-5ºC 245 +0/-5ºC 250 +0/-5ºC 225 +0/-5ºC 240 +0/-5ºC 260 +0/-5ºC 260 +0/-5ºC Peak Temperature (Tp) Time Within 5ºC of Actual Peak Temp. (tp) 10-30 seconds 10-30 seconds 10-30 seconds 20-40 seconds 10-30 seconds 10-30 seconds 10-30 seconds 20-40 seconds Ramp-down Rate 6ºC/second Max. 6ºC/second Max. 6ºC/second Max. 6ºC/second Max. Time 25ºC to Peak Temp. 6 Minutes Max. 8 Minutes Max. 6 Minutes Max. 8 Minutes Max. AMIS Solder Peak Temperature for Pb-Free is 260 +0/-5°C

  11. Re-Flow Profile for Moisture Sensitivity Assessment AMIS Solder Peak Temperature for Pb-Free is 260 +0/-5°C

  12. Impact Pb-Free Solder onPackage Construction Laminated Package Leaded Package DIE DIE DIE Solder Lead Finish Solder Balls • Exposure to Higher Solder Temperatures • The Impact from 220 to 240 or260°C Solder Temperatures • Solderability • The Interaction Between the Pb-free Component Finish & Solder Paste • Interface Adhesion Between Materials • The Higher Probability that Interfaces will Separate as they are Exposed to the High Solder Temperature • Thermal Stability in Compound/Die Attach/Substrate • Electrical Contact Resistance

  13. Changes in Bill of Assembly Materials • Lead Frame Packages = AMIS goes Green • New Materials for Die Attach & Mold • Materials that Withstand 260°C • Halogen Free Materials • Lead Finish • Pure Sn Plating is Selected as Solution • Pure Sn is the most Mainstream Solution • Post plate bake is part of the AMIS process flow and demonstrated good results as whisker mitigation process • NiPdAu is available as an alterative finish option

  14. Changes in Bill of Assembly Materials • Laminate Packages = AMIS goes RoHS Compliant • Existing Substrates are RoHS Compliant & Qualified • Green Substrates are Available but more Expensive & not yet Qualified • New Materials for Die Attach & Mold • Materials that Withstand 260°C • Halogen Free Materials • Lead Finish • Sn- 4.0Ag- 0.5Cu has been Selected (most std at Subs)

  15. Qualified Stress Test Conditions AEC – Q100 REV-F AMIS Part OperatingTemperature Grades Grade 0 (- 40 / 150°C) Grade 1 (- 40 / 125°C) Grade 2 (- 40 / 105°C) Grade 0 (- 40 / 150°C) Grade 1 (- 40 / 125°C) Per J-STD-020 Minimum Level 2260ºC max. Re-Flow Temperature Preconditioning Per J-STD-020 for SMD components HAST 130°C / 85% / Bias – 96 hrsFor Product Qualifications THB or HAST 85°C / 85% / Bias – 1000 hrs Autoclave or unbiased HAST 121°C / 100% – 96 hrsFor Package Qualifications 121°C / 100% – 96 hrs HAST 130°C / 85% – 96 hrs - 65/175°C, 500x - 65/175°C, 1000x - 65/150°C, 500x - 65/150°C, 1000x Temp Cycle - 65/175°C, 500x - 50/175°C, 1000x - 50/150°C, 2000x - 65/150°C, 500x - 50/150°C, 1000x - 50/150°C, 500x - 50/125°C, 1000x - 40/150°C, 1000x - 40/125°C, 1000x - 40/105°C, 1000x - 40/150°C, 1000x - 40/125°C, 1000x Power Temp Cycle 175°C, 1000 hrs 175°C, 2000 hrs 150°C, 1000 hrs 150°C, 2000 hrs High Temp Storage Life (plastic pkg) 175°C, 1000 hrs 150°C, 2000 hrs 150°C, 1000 hrs 175°C, 500 hrs 125°C, 1000 hrs 150°C, 500 hrs

  16. AMIS RoHS-GreenQualification Status

  17. Product Marking & Labeling • In Alignment with JESD97 • Components Contain Pb-Free Category Code • Labels Contain • Pb Free Category Code • Safe Maximum Temperature • Moisture Sensitivity Level

  18. AMIS RoHS-Green Project Status • The Majority of the Packages Offered by AMIS are Green or RoHS Qualified • AMIS will Continue to Provide Non-RoHS & Non-Green Products unless Requested Differently • Green & RoHS Compliant Product is Available Upon Request • Contact AMIS Sales for more Information • AMIS Operational Systems have been Adjusted to Recognize & Distinguish Green & RoHS Compliant Product from the Existing Production

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