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Infineon (Ericsson Microelectronics) Modules and Tools

Infineon (Ericsson Microelectronics) Modules and Tools. OEM Bluetooth Solutions. Bluetooth Products. Bluetooth Technology IP. Ericsson Bluetooth Layers. SonyEricsson. Ericsson Microelectronics. Ericsson Technology Licensing. Existing (Older) Products. PBA31301

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Infineon (Ericsson Microelectronics) Modules and Tools

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  1. Infineon (Ericsson Microelectronics) Modules and Tools

  2. OEM Bluetooth Solutions Bluetooth Products Bluetooth Technology IP Ericsson Bluetooth Layers SonyEricsson Ericsson Microelectronics Ericsson Technology Licensing

  3. Existing (Older) Products • PBA31301 • Plug and Play Class 2 Transceiver • ROK101008 • PtP MCM, Complete BT function • ROK101007 • 1st generation PtM MCM

  4. Development Products • LPY 111 445 • LPY 111 453 • Bluetooth Starter Kit • LPY 111 xxx • New daughter modules for the Starter Kit • LZY xxx yyy • Software for the Starter kits Supports development using Bluetooth Modules and chipsets. Easy upgrade with new daughter boards.

  5. Development Tools • Software • ECP Software • HCI Toolbox • The Bluetooth Host Stack • One licence for development purposes only in executable form (for PC) • HCI driver • L2CAP • SDP • RFCOMM

  6. Expanding product portfolio

  7. Bluetooth Long Range Radio Module, PBA 313 02 • Features • Requires only an antenna and a 10-20 MHz reference clock to form complete Bluetooth radio functionality • 11.8 X 11.8 Line Grid Array (LGA) package • Ideal for applications requiring a flexible form factor • A height of only 1.6 mm • Built in RF shielding! • Key performance • Typical RF output power 17 dBm, Class 1 (“100 m”) • Sensitivity level -86 dBm (typical) at BER 0.1% • Temperature range -30 to +75ºC • Pre-qualified to Bluetooth specification 1.1

  8. Bluetooth Radio, PBA 313 05 • A small cost effective Radio based on RFCMOS technology • Requires only an antenna and a 13 MHz reference clock to form complete Bluetooth radio functionality • 9 x 9 Line Grid Array (LGA) package • Ideal for applications requiring a flexible form factor • A height of only 1.6 mm • Self shielding design! • Key performance • RF output power 0 dBm, Class 2 (“10 m”) • Sensitivity level -80 dBm (typical) at BER 0.1% • Temperature range -20 to +75ºC • Pre-qualified to Bluetooth specification 1.1

  9. Counters timers Interrupt controller ARM core Clock control IROM AMBA BUS External Bus Control SRAM I2C I2CIF/ PIO Ericsson Bluetooth Core USB Bluetooth radio USB+FIFO:s RS-232 UARTS +FIFO:s PCM Baseband controller

  10. Blink Overview PBM 990 90 Bluetooth baseband chip with external Flash • 0.25mm • 2.5 V • Low Leakage process • Packaged in a 96 pin BGA. • 64 k byte SRAM • 4 k ROM • Variable system frequency • Ericsson Bluetooth Core External Memory ARM7 core ROM 4kbytes System controller Interrupt controller GPIO AMBA AHB AHB/APB bridge I2C UART1 USB SRAM 64kbyte Ericsson Bluetooth Core AMBA APB UART2

  11. Flink Overview PBM 990 80 Bluetooth baseband with internal Flash • 0.25mm • 2.5 V • Low Leakage process • Packaged in a 64 pin BGA • Internal Flash 4 - 16Mbit • 64 k byte SRAM • 4 k ROM • Variable system frequency • Ericsson Bluetooth Core Flash Memory 4 -16Mb ARM7 core ROM 4kbytes System controller Interrupt controller GPIO AMBA AHB AHB/APB bridge I2C UART1 USB SRAM 64kbyte Ericsson Bluetooth Core AMBA APB UART2

  12. HCI HCI Audio MEM Link Manager FW Link Controller FW = FirmWare Bluetooth Radio FW USB 50  Antenna UART BASEBAND PCM MCM, ROK 101 007 & ROK 101 008 Multi-Service Applications • Complete Bluetooth function • HardWare: Radio, Baseband and Flash • FirmWare: LC, LM and HCI • Type approved according to FCC/ETSI • Class 2 (“10 m”) • 33 x 17 x 3 mm • Two versions • Point to Point (ROK 101 008) Pre-qualified for Bluetooth 1.0b + critical errata • Point to Multipoint (ROK 101 007) Pre-qualified for Bluetooth 1.1 • Featuring • 7 slaves • 64k RAM, 8 Mbit Flash • USB,UART,PCM,I2C,GPIO NOT for new designs !!

  13. HCI HCI Audio MEM Link Manager FW Link Controller FW = FirmWare Bluetooth Radio FW USB 50  Antenna UART BASEBAND PCM 2nd GenerationMCM ROK 104 001 • Complete Bluetooth function • HardWare: Radio, Baseband and Memory • FirmWare: LC, LM and HCI • Pre-qualified for Bluetooth spec 1.1 • Type approved according to FCC/ETSI • Class 2 (“10 m”) • RF shield • Size: 10.5x15.5x2.1 mm • Featuring • Point to Multipoint, 7 slaves • 64k RAM, 4-16Mbit Flash • USB,UART,PCM,I2C,GPIO

  14. Bluetooth Products Availability Radio Low Cost Std Long Range PBA 313 01 PBA313 02 PBA 313 05 Samples : Volume : NOW NOW NOW NOW NOW NOW Baseband Baseband + Flash Baseband PBM 990 90 PBM 990 80 Samples (early adopters) : Volume : NOW NOW NOW NOW PtM 2nd gen PtP PtM 1st gen MCM ROK101 008 ROK101 007 ROK 104 001 Samples : Volume : NOW NOW NOW NOW NOW NOW

  15. Do It Yourself vs Modular Solution Do It Yourself • Need specialized RF knowledge • Each design requires certification • Diversion from core competency • Longer Time-to-Market • Overall optimization is difficult to achieve • May implement smaller and more area-flexible solution • May have lower BoM cost • May be more expensive overall • Design & Development Costs • Production Yields • Tighter Process Controls • Repair Cost • Certification and Type approval Modular Solution • No specialized RF knowledge needed • Pre-certification possible • Can focus on core competencies • Shorter Time-to-Market • Optimized sub-assembly • Fixed form factor • Generally more costly than BoM • May be less expensive overall • Experience drives lower cost

  16. Ericsson Microelectronics Bluetooth SW Products Bluetooth Stacks • Ericsson Bluetooth Host Stack • Ericsson Embedded Stack - Two CPU solution (ECP) Software Tools • HCI Toolbox • ECP Software • PC reference Stack • Flash-tool

  17. RFCOMM SDP TCS BNEP RFCOMM SDP TCS BNEP Ericsson Bluetooth SW Stack products Application NO HOST MC! API Host SPP GAP SDAP Application L2CAP API HCI VS HCI Serial Media - UART, USB Serial Media - UART, USB Serial Media - UART, USB Application VS HCI HCI LM API SPP GAP SDAP MCM SDAP GAP SPP RFCOMM SDP TCS BNEP L2CAP LM L2CAP LM “Bluetooth Embedded Application Solution” “Bluetooth Embedded Stack Solution” “Bluetooth Host Stack Solution”

  18. HCI Toolbox • Logical and stress testing • Control of Radio • Indicative BER testing • Point-to-point & multi-point testing • User defined macros • Runs on PC/Windows environments

  19. Flash-tools • Enables firmware upgrades • Supports both USB (DFU 1.0) and UART • Works on Windows/PC environments.

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