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Packaging and MEMS for RF/ microwave. Packaging and MEMS for RF/ microwave. Program: 09:00 Registration, coffee 09:30 Opening/Introduction 09:45 Wolfgang Heinrich: “Flip-chip for Millimeter-Wave and Broadband Packaging”
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Packaging and MEMS for RF/ microwave
Packaging and MEMS for RF/ microwave Program:09:00 Registration, coffee 09:30 Opening/Introduction 09:45 Wolfgang Heinrich: “Flip-chip for Millimeter-Wave and Broadband Packaging” 11:00 W. Heinrich: “Modeling the package of a GaN power transistor” 11:45 Lunch 12:45 Kari Kautio, “LTCC – packaging & smart system integration” 14:00 Coffee break 14:30 Héctor J. De Los Santos, “Applications and Trends in RF - MEMS” 15:45 General discussion / Concluding remarks 16:00 – 16:30 Seminar closing
Vestfold University College Health and Nursing Electronics Teaching Education Electro automation Maritime Education Data VUC Administration Science and Engineering Social Sciences Product design
44 34 23 19 9 5 Micro- and nanotechnology at VUC • Close to 20 Ph.D. students • International master study (taught in English) • Up to 20 students admitted per year • Bachelor study (in Norwegian) • Research • Building methods for MNT • Interconnection • Packaging • 3D integration • Micro- and nano-systems for: • Energy harvesting • Biomedical applications • RF applications • Optical applications • Maritime applications • ...
Vestfold UC / IMST and the local industry cluster has national status as Norwegian Center of Expertise - in micro- and nanotechnology Norwegian Center of Expertise – Micro- and Nanotechnology
Organisation for ICT and Electronics companies in Vestfold 34 member companies/ institutions Team packaging: Individual members from the companies/ institutions Meetings for open-minded discussions on challenges in packaging Network of colleagues Seminars Electronic Coast
http://imst.hive.no/ Research Summary Select ”Research” and ”Research Summary 2008” More information – VUC/ IMST