Global 3D IC and TSV Interconnect Market worth $6.55 billion

1. MarketsandMarkets Presents Global 3D IC and TSV Interconnect Market worth $6.55 billion by 2016 http://www.marketsandmarkets.com/Market-Reports/3D-IC-Chip-and-TSV-Interconnect-Market-117.html

2. According to a new market research report “Three-dimensional Integrated Circuit (3D IC/Chip) & Through-Silicon Via (TSV) Interconnects Market - Global Forecast & Trend Analysis (2011 - 2016) By Technology (Substrate, Bonding Techniques, Process Realization, Fabrication), Products (Memory, LED, Sensor, MEMS, Power & Analog Components) & Applications (Mobile Devices, Processors, ICT, Networking, Automotive, Defense)” published by MarketsandMarkets, the total 3D IC market is expected to reach $6.55 billion by 2016 at a CAGR of 16.9% from 2011 to 2016. Browse >> 70 data tables. 14figures. in-depth TOC on 3D IC Chip and TSV Interconnect Market. http://www.marketsandmarkets.com/Market-Reports/3D-IC-Chip-and-TSV-Interconnect-Market-117.html Early buyers will receive 10% customization on this report. Request to Download Free PDF Brochure @ http://www.marketsandmarkets.com/pdfdownload.asp?id=117

3. The transition from 2 dimensional (2D) packaging to 3D packaging is considered to be one of the major developments in the semiconductor industry. 3D packaging is observed to pave way for the concept of “More than Moore” with comparatively lesser investment. This has led to strategic innovation with respect to 3D integration despite the economic downturn. The use of TSV interconnects within die stack instead of wirebond interconnect and board-level routing helps to save the system energy consumption to a large extent. Some of the early innovations related to TSV include that from Samsung (South Korea) and Xilinx (U.S.). The global 3D IC market is expected to grow from $2.21 billion in 2009 to $6.55 billion in 2016 at a CAGR of 16.9% from 2011 to 2016. Asian region is observed to have the highest growth rate. This is mainly attributed to the presence of a huge number of companies such as Taiwan Semiconductor Manufacturing Company Limited (Taiwan), Samsung (South Korea), United Microelectronics Corporation (Taiwan), and more who contribute to different aspects of 3D IC manufacturing and thus help to address the challenges associated with its manufacture in a cost effective manner. Inquire Before Buying @ http://www.marketsandmarkets.com/Enquiry_Before_Buying.asp?id=117

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5. About MarketsandMarkets MarketsandMarkets is a global market research and consulting company based in the U.S. We publish strategically analyzed market research reports and serve as a business intelligence partner to Fortune 500 companies across the world. MarketsandMarkets also provides multi-client reports, company profiles, databases, and custom research services. They cover thirteen industry verticals, including advanced materials, automotives and transportation, banking and financial services, biotechnology, chemicals, consumer goods, energy and power, food and beverages, industrial automation, medical devices, pharmaceuticals, semiconductor and electronics, and telecommunications and IT. We at MarketsandMarkets are inspired to help our clients grow by providing apt business insight with our huge market intelligence repository. http://www.marketsandmarkets.com/Market-Reports/3D-IC-Chip-and-TSV-Interconnect-Market-117.html