1 / 6

SSI Process Backup using the SVG

SSI Process Backup using the SVG. Lilah Cook MCEE 550 Fall 2013 Factory Improvement Project Dr. Lynn Fuller. Revised: 4-8-14. SSI & SVG Coat. SSI Coat Experiment. SVG Coat Experiment. 2 Wafers coated using SVG track with Oir630 resist

domani
Download Presentation

SSI Process Backup using the SVG

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. SSI Process Backup using the SVG Lilah Cook MCEE 550 Fall 2013 Factory Improvement Project Dr. Lynn Fuller Revised: 4-8-14

  2. SSI & SVG Coat SSI Coat Experiment SVG Coat Experiment 2 Wafers coated using SVG track with Oir630 resist Created program 6 on SVG track 1b to emulate the spin steps from the SSI Check oven 1 temp ~140 Change oven 2 temp ~90 Remove lid on cover for manual dispense Select program 1 on track 1a for the standard prime Select program 6 on track 1b Start 1a then 1b Manually dispense resist when wafers reach spin coater • 2 Wafers coated using Coat.rcp with Oir620 resist • Coat.rcpbreakdoawn • Acceleration: 15 krpm • Oven 1 temp: 140 (60s) • Oven 2 temp: 90 (60s) • SpinSteps • 0  800 rpm (5s) • 800  3400 rpm (5s) • 3400  2000 rpm (25s) • Automatic dispense

  3. Coat Comparison Spectramap 49 Point Resist Measurements: SVG Wafer 1: 10553 A Std 0.36% Wafer 2: 10578 A Std 1.00% SSI Wafer 1: 10354 A Std 0.92% Wafer 2: 10288 A Std 0.81%

  4. Pattern and Develop • Lightly scribed the back of the SVG wafers and placed all four wafers into the ASML for level 1 and JG n well patterning • SSI Develop • Wafers went through the develop.rcp recipe with no problem • SVG Develop • SVG track has NO post exposure bake oven so replication would be impossible • Created Program 6 on track 2 which doubles the standard 60 second develop found in the SSI track • Needed to be broken up into two steps as max input in SVG in 99 seconds • Wafers developed with 60 seconds develop ad a 15 second rinse • Waiting for approval to add program steps to manual

  5. Develop Comparison

  6. Conclusions • The above optical images shows that the nwell pattern has fully been developed • SVG tracks can be used to emulate the SSI track when patterning large features • Track 1a: Program 1 (standard Prime) • Track 1b: Program 6 (SSI Coat replica) • Track 2 : Program 6 (Oir620 Develop) • Working with SMFL staff to add program descriptions and recipes to the SVG manual

More Related