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Activities in the Electronics Group « GrElec »

Activities in the Electronics Group « GrElec ». GrElec in 2012. 3+1 Electronics Engineers Daniel La Marra Stéphane Débieux Yannick Favre Alessandro La Rosa IBL 2 Technical Assistants Gabriel Pelleriti Javier Mesa. Projects Highlight. ATLAS (LHC) IBL (upgrade phase0 2013-2014)

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Activities in the Electronics Group « GrElec »

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  1. Activities in theElectronics Group« GrElec »

  2. GrElec in 2012 • 3+1 ElectronicsEngineers • Daniel La Marra • Stéphane Débieux • Yannick Favre • Alessandro La Rosa • IBL • 2 Technical Assistants • Gabriel Pelleriti • Javier Mesa 2012 ElectronicHighlights

  3. Projects Highlight • ATLAS (LHC) • IBL (upgrade phase0 2013-2014) • ABCn130 (upgrade phase2 2022) • Neutrinos • MICE (production) • Astrophysique • LOFT • POLAR 2012 Electronic Highlights

  4. IBL : Local support - stave 2012 Electronic Highlights

  5. IBL :Dressed module withflex 2012 Electronic Highlights

  6. IBL - Loadingprocedure 2012 Electronic Highlights

  7. IBL : Test bench for PCB/Flex Saver production • Purpose : Full production test : ~80 PCB savers, 500 Flex savers • Details : • 320 signals / PCB saver : automatic test for short & open circuit on each signal • FPGA firmware development for signals stimulus & PC communication (Yannick) • PC software development for checking & reporting (Yannick) • Test execution (Gaby) PCB saver Flexsavers Xilinx Stimulus Board PC interface Saverunder test Checked OK for ID=1 2012 Electronic Highlights HW interface

  8. IBL : IST & beam pipe EMI qualification • Purpose : Screening qualification against ElectroMagnetic Interference • Measurement : Transfer impedance + Screening attenuation vs frequency : • Tube under test inserted into a copper tube for environment insensitivity • IBL Support Tube (IST) qualification (carbon fiber + Ag glue + end rings) • Beam pipe shielding methods investigation & qualification • Hardware : Vector Network Analyzer [100KHz-4GHz] Tubes under test IST Beam Pipe VNA Bad shielding Copper tube enclosure 2012 Electronic Highlights Good shielding

  9. ABCn-130 :Main improvements 2012 2012 Electronic Highlights

  10. ABCn-130 : Layout (not final) Submission Scenarios • Independent of HCC • Regular MOSIS MPW on 4th February 2013 (reachable for ABC130, not for HCC) • Shared Engineering run with the NA62/TDCpixsubmission (forecast 1Q 2013, may be very close to the MOSIS MPW date, but with some flex.) • With HCC : • Engineering Run, attached to HCC schedule Preferred scenario Chip size7900 um x 6700 um 2012 Electronic Highlights

  11. DBB : Digitizer & Buffer Board • Context : • MICE experiment (RAL/UK) • Electron Muon Ranger detector (EMR) • Part of a collaborative team with the Front End Board • Board & FPGA design + test : StéphaneDébieux Mice experiment EMR 2012 Electronic Highlights

  12. DBB : Overview DIP switch for Board ID AlteraStratixII FPGA Power Supply : 3 DC/DC Connector for FPGA programming 2 Gigabit transceivers LVDS Connections to FEB DAQ SMA Connectors Connectors for DBBs daisy-chain 2012 Electronic Highlights

  13. DBB : Current status • Further tests in the lab qualified the DBB for production • 54 boards to be produced identically to the first 6 prototypes • 2 to 3 months delay expected for the production, delivery in March/April 2013 2012 Electronic Highlights

  14. LOFT : Large Observatory For x-ray Timing • Context : • Matter in neutrons Stars & close to black hole event horizon • ESA program, launch 2020-22 • Wide Field Monitor : high resolution • Large Area Detector : 10m² of detector 2-30keV : • 6 panels • 7x3 modules/panel • 4x4 Front End Electonics/modules => 2016 FEE overall : DPNC/ISDC design responsibility Panel • FEE : • ~130x70mm • Very low noise • Silicon Drift Detector technology (used in ALICE) • 14 ASICs per FEE, 16 channels/ASIC • Chip On Board technology, very small pads (39µ) • Bonding: ASIC to SDD (17µ),Through PCB Bonds, ASIC to PCB • PCB: Flex-Rigid technology Module Back End Electronics FEE 2012 Electronic Highlights SDD (bottom)

  15. LOFT : Large Observatory For x-ray Timing • FEE Prototype 2012 : • Large PCB for measurements access, Small SDDetector Proto, EMC & HV constraints • Components: 4 ASICs, linear regulators, digital interfaces, HV/MV filters • Labview interface • Board Design Schematics + Layout: Yannick • Components & ASIC mounting/bonding: Gaby, Maarten • Tests : in progress at BOLOGNA 75um PCB trace width Trough PCB hole for bonding ASIC SDD location 39um square pads 2012 Electronic Highlights

  16. POLAR : An instrument to measureGamma Ray Burstspolarization • 2 layers flex with stiffener: • Design made by PSI • Schematics and Layout was imported into our Cadence tools • Modification with close relationship with the mechanics group • Added a rigid part (stiffener) • Length changed 2012 Electronic Highlights

  17. POLAR : An instrument to measureGamma Ray Burstspolarization • News in this design: • Very small via between 2 layers • Hole: 0.09mm • Pad: 0.15mm 2012 Electronic Highlights

  18. This year was going on with some works initiated last year or even before: IBL ABCn130 MICE There was also new works for several different projects like: LOFT POLAR But we also started some studies for new projects like: NA61 (neutrinos) DAMPE (astrophysics) JEM-EUSO (astrophysics) Conclusion 2012 Electronic Highlights

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