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Computational Models for Fatigue-Life Prediction of Solder Joints of Electronic Packages

Fatigue Life Prediction of Solder Joints. . Objectives. Develop Finite Element (FE) models for fatigue-life prediction of solder joints of electronic packagesValidate the energy-based method in fatigue prediction for solder joints of packages by a combined numerical and experimental approachProv

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Computational Models for Fatigue-Life Prediction of Solder Joints of Electronic Packages

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    1. Computational Models for Fatigue-Life Prediction of Solder Joints of Electronic Packages Hasan U. Akay and Yan Liu Computational Mechanics Laboratory Department of Mechanical Engineering Indiana University-Purdue University Indianapolis (IUPUI) Indianapolis, IN 46202 My name is Yan Liu, I am a graduate student from Indiana Univ.-Purdue Univ. at Indianapolis. My advisor is Dr. Hasan Akay, My topic is We are collaborating with boeing in this projectMy name is Yan Liu, I am a graduate student from Indiana Univ.-Purdue Univ. at Indianapolis. My advisor is Dr. Hasan Akay, My topic is We are collaborating with boeing in this project

    2. Fatigue Life Prediction of Solder Joints Objectives Develop Finite Element (FE) models for fatigue-life prediction of solder joints of electronic packages Validate the energy-based method in fatigue prediction for solder joints of packages by a combined numerical and experimental approach Provide fatigue coefficients for life predictions Past and Present Sponsors U.S. Army U.S. Navy United Technologies/Carrier Electronics Boeing Company

    3. Fatigue Life Prediction of Solder Joints

    4. Fatigue Life Prediction of Solder Joints Dorn’s Creep Law and Creep Energy Approach for Solder Previous studies show that creep the most harmful mechanism causing the failure of solder material. People were using several different equations to describe the creep behavior of solder material. We were always using this Dorn’s equation in our study.Previous studies show that creep the most harmful mechanism causing the failure of solder material. People were using several different equations to describe the creep behavior of solder material. We were always using this Dorn’s equation in our study.

    5. Fatigue Life Prediction of Solder Joints Combined Numerical and Experimental Approach to Determine Fatigue Coefficients

    6. Fatigue Life Prediction of Solder Joints

    7. Fatigue Life Prediction of Solder Joints

    8. Fatigue Life Prediction of Solder Joints Typical failure mode of solder joints in PBGAs (Boeing)

    9. Fatigue Life Prediction of Solder Joints Proposed Method to Predict Fatigue Life

    10. Fatigue Life Prediction of Solder Joints Typical 2D FE Models for Conventional SMTs

    11. Fatigue Life Prediction of Solder Joints Different PBGA Packages Investigated (1/8th 3D Models)

    12. Fatigue Life Prediction of Solder Joints Typical Sliced 3D Model of a PBGA Package

    13. Fatigue Life Prediction of Solder Joints Typical Temperature Cycles

    14. Fatigue Life Prediction of Solder Joints Contour plot of maximum effective stress/creep strain on the seventh solder joint in 324-PBGA

    15. Fatigue Life Prediction of Solder Joints Correlations by Using Different FE Models

    16. Fatigue Life Prediction of Solder Joints

    17. Fatigue Life Prediction of Solder Joints Summary of Correlations All three FE models can reasonably predict the fatigue life of PBGA packages Different fatigue coefficients exist for different FE models (Plane Stress, Plane Strain, 3D, etc.) Different fatigue coefficients exist for different types of packages

    18. Fatigue Life Prediction of Solder Joints Conclusions With the high efficiency in modeling and accuracy in prediction, the simplified FE models (2D plane stress or sliced 3D) can be used for PBGA packages in thermal fatigue prediction. As more data become available, the FE simulations may replace the actual reliability experiments because of the savings in time and test expenses.

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