Electronics Challenges in Europe - ICT Work Programme 2007-08<br>

1. NCPs MeetingBrussels, 19 October 2006 ICT Work Programme 2007-08:Activities under Challenge 3Erastos FilosDirectorate “Components & Systems”European Commission, Brussels EF_to_NCPsMtg_Challenge3 - 1

2. Presentation outline • R&D in electronics & its key role for Europe’s competitiveness • Challenge 3 rationale • Foreseen activities under Call 1 • Foreseen activities under Call 2 • Joint Technology Initiatives – a way to implement ETP Strategic Research Agendas EF_to_NCPsMtg_Challenge3 - 2

3. Source: Future Horizons, IFS2005, Jan 2005 € 30,050 bn World GDP Electronic Equipment € 1,050 bn Semiconductors € 210 bn € 38 bn Investment: Materials & Equipment The pervasiveness of electronics … Electronics underpins everybusiness sector EF_to_NCPsMtg_Challenge3 - 3

4. Electronics: Key to intelligent products • Smarter products: • Electronic safety • Driver customisation • Resource-efficient products: • Fuel efficiency • Info-mobility & traffic management • ICT-enabled disposal • Value-adding services: • Active safety features • Remote diagnostics & assistance • Infotainment & travelguidance By 2010, electronics & software in cars will account for up to 40% of their value EF_to_NCPsMtg_Challenge3 - 4

5. Europe - losing the game ? • Europe – a net importer of electronics • Aggressive global competition: Asia 2/3 of world semiconductor market & 3/4 share in investment • A typical semiconductor fabrication facility costs € 2.5 billion Source: European Semiconductor Industry Association, 2005 EF_to_NCPsMtg_Challenge3 - 5

6. European microelectronics achievements • World top-10 list of semiconductor companies: • 1990: 1 European company • 2004: 3 European companies • 2006: ? • Equipment: • Wafer processing: • 5 European SMEs on top 10 list • Europe’s big 2 (ASML and ASM Int’l)on top 10 • Assembly equipment: • 2 European companies on top 10 list • Consensus building in nanoelectronics • Strategic public-private partnership VLSI Research 2003 www.eniac.eu EF_to_NCPsMtg_Challenge3 - 6

7. Challenge 3:Components, Systems, Engineering To enable Europe’s industry to stay at the forefront of electronics developments & applications through chip making, integration & embedded systems capabilities www.eniac.eu www.artemis-office.org www.photonics21.de www.smart-systems-integration.org R&D objectives are in line with Strategic Research Agendas of European Technology Platforms & support international co-operation under the Intelligent Manufacturing Systems initiative cordis.europa.eu/ims EF_to_NCPsMtg_Challenge3 - 7

8. Foreseen activities under Call 1: 3.3.1.1: Next-Generation Nanoelectronics Components & Electronics Integration 3.3.1.2: Organic & Large-Area Electronics & Display Systems 3.3.1.3: Embedded Systems Design 3.3.1.4: Computing Systems EF_to_NCPsMtg_Challenge3 - 8

9. Next-Generation Nanoelectronics Components & Electronics Integration • Smaller, higher performance, lower cost: • “More Moore” • Beyond CMOS • Integration & diversification: • SoC: Systems-on-Chip • SiP: Systems-in-Package Technology materials, processes, metrology, interconnects, modelling, packaging, architectures Design increased complexity, changed performance, heterogeneity in SiP & SoC, productivity & “Design for Manufacturing” Manufacturing Cost-efficient, flexible production for silicon < 45 nm; for SoC & SiP; 450 mm wafer size; small batch/fast cycle time; equipment assessment • Call 1: • € 86 mn • CP, NoE, CSA EF_to_NCPsMtg_Challenge3 - 9

10. Organic & Large-Area Electronics & Display Systems • Organic & large-area technologies: • Large-area & low-cost manufacturing • Advanced modelling, simulation & circuit design characterisation • Enabling functions: • logic, memory, e-paper, systems-on-tags, RFIDs, lab-on-chip, lighting, signage, energy scavenging/storage & power management • Advanced display systems: • Visualisation systems supporting • Multi-viewer unaided, unrestricted 3D-viewing & natural interaction • Signal acquisition, processing & representation for 3D-systems • Portable display systems • Zero-power displays, ruggedised displays • Flexible/transparent devices • Energy-efficient micro-projectors • Lightweight high-resolution vision glasses Call 1:€ 63 mnCP, NoE, CSA EF_to_NCPsMtg_Challenge3 - 10

11. Embedded Systems Design • Call 1: • € 40 mn • CP, NoE, CSA • Target outcomes • Theory & methods for embedded systems design • Key issues: heterogeneity, composability, predictability & adaptivity • International cooperation is encouraged • Suites of interoperable design tools for rapid design & prototyping • Research will contribute to interoperability of tools from SME vendors; consolidating tool developers’ joint R&D work; pen tool frameworks • Expected impact • Increase system development productivity (at least 1 order of magnitude) • Stimulate growth of European high-tech companies in the field • Reinforce S&T leadership in complex systems engineering EF_to_NCPsMtg_Challenge3 - 11

12. Computing systems • Call 1: • € 25 mn • CP (STREP), NoE • Target outcomes • Novel architectures for multi-core computing systems • Architectures & system software for scalable & customisable on-chip computing systems incorporating multiple networked, symmetric or heterogeneous, fixed or reconfigurable processing elements • Key issues: power & performance versatility; reliability & availability • Reference architectures for generic embedded platforms • Key issues: composability, networking, robustness/security, diagnosis/maintainability, resource management, evolvability & self-organisation • Expected impact • Inexpensive generic platforms with high European added value enabling European supplier companies to increase market share • Develop European competences in the use of high-end computing for the development of new applications • European excellence in computing architectures, system software & platforms EF_to_NCPsMtg_Challenge3 - 12

13. Foreseen activities under Call 2: 3.3.2.1: Photonic components & subsystems 3.3.2.2: Micro/Nanosystems 3.3.2.3: Networked Embedded & Control Systems EF_to_NCPsMtg_Challenge3 - 13

14. Photonic Components & Subsystems Components & Subsystems Core Application specific - Lasers & solid-state sources - Image sensors - New sensors • Broadband core networks • Broadband access & LAN • Medical diagnosis & prevention • Sensors for environment, safety & security applications Call 2:€ 90 mnCP, NoE, CSA Underlying technologies Integration Manufacturing Design methodology & tools Complementary measures Assessment of prototypes Networking, integration & structuring Support measures Consensus building:R&D strategies, int’ cooperation Access: Expertise centres & foundries Education: Young people & graduates EF_to_NCPsMtg_Challenge3 - 14

15. Micro/Nanosystems • Next generation smart systemsSensor- & actuator-based systems • Nano-Bio-ICTechnologies convergenceBiosensors, lab-on-a-chip, bioMEMS, autonomous implants • Smart fabrics and interactive textilesIntegration of intelligence in textile materials • From smart systems to viable productsMicrosystems manufacturing technologies • Innovative memory systemsEmerging technologies for high density mass storage capacity • Support actionsTechnology access, education and training, coordination & dissemination at EU level • Call 2: • € 83 mn • CP, NoE, CSA EF_to_NCPsMtg_Challenge3 - 15

16. Call 2: • € 47 mn • CP, NoE, CSA Networked Embedded & Control Systems • Target outcomes • Middleware platforms for embedded systems • Key issues: composability, minimum power consumption, openness • Emphasis: programmability, reconfiguration, privacy & trust • Cooperating objects and Wireless Sensor Networks • Spontaneous cooperation of objects in spatial proximity • Emphasis on new methods & algorithms, hardware/software platforms for distributed execution & programming & tools for self-organising systems • Control of large-scale complex distributed systems • Key issues: efficiency, robustness, safety, security • Applications: manufacturing plants, infrastructures • Expected impact • Enable entirely new services & applications • Make large infrastructures more efficient, flexible & productive • 100% plant availability, reduce maintenance & accidents EF_to_NCPsMtg_Challenge3 - 16

17. POLICY RESEARCH BUSINESS European Technology Platforms A spiral model of innovation capitalising on the multiple reciprocal relationships between public & private stakeholders at various knowledge stages 30+ European Technology Platforms launched so far: • Addressing major technological challenges in specific domains • Aiming to leverage public & private investment for R&D & innovation • Involving key R&D stakeholders • eg industry, the research community & public authorities • Bundling fragmented R&D efforts towards agreed goals • Vision 2020 document & Strategic Research Agenda cordis.europa.eu/technology-platforms EF_to_NCPsMtg_Challenge3 - 17

18. Joint Technology Initiatives:A way to implement a Strategic Research Agenda • Emergence & setting up: • „Bottom-up“ process with key stakeholders in a specific domain • Key deliverable: Strategic vision document • Definition of a Strategic Research Agenda • Co-ordinated by an Advisory Council • Consensus-based • Deployment strategy • Implementation of the Strategic Research Agenda • Through collaborative research in FP7 & with other resources, or • Through a Joint Technology Initiative (JTI) which integrates funding sources, eg Framework Programme, transnational & nat’l research programmes, industrial funding, 3rd party private finance Commission Staff Working Paper, SEC(2005)800 of 10 June 2005 &Status Report 2 of May 2006cordis.europa.eu/technology-platforms/further_en.html EF_to_NCPsMtg_Challenge3 - 18

19. For more information European research on the web: http://cordis.europa.eu http://cordis.europa.eu/fp7 http://ec.europa.eu/comm/research/future/ Information Society and Media: http://ec.europa.eu/information_society/ http://cordis.europa.eu/ist Directorate G: http://cordis.europa.eu/ist/directorate_g Contact: erastos.filos@ec.europa.eu EF_to_NCPsMtg_Challenge3 - 19