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Thermal Transport Internal Heat Sources External Insulation

Thermal Transport Internal Heat Sources External Insulation. COM GL Locomotion Phase Lead. 1. Thermal Considerations. Assumptions: Solar Panels Reflect Unused Solar Energy Completely Thermal Blanket keeps Energy Transfer through body to 0 J/s

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Thermal Transport Internal Heat Sources External Insulation

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  1. Thermal TransportInternal Heat SourcesExternal Insulation COM GL Locomotion Phase Lead [John Dixon] [COM] 1

  2. Thermal Considerations [John Dixon] [COM] • Assumptions: • Solar Panels Reflect Unused Solar Energy Completely • Thermal Blanket keeps Energy Transfer through body to 0 J/s • Above includes MLI comprised of Kapton (or Teflon) / Silver Lined Reflective Surface, Kapton Insulation (with scrim separation) • Thermal Heat Sinks radiate to Coldest Possible Surface • Steady State Conduction 2

  3. Insulation/Heat Sink [John Dixon] [COM] • Copper Heat Emission • q/t = 730.432 J/s (from emissivity of Copper) • Cu mass = 6.08 kg • One heat vane traveling to each side of the rover • @max CPU Operating Temp • Multi-Layer Insulation (MLI) • Insulation mass= 0.898 kg • Total Thermal Control Mass: 6.98 kg 3

  4. Thermal Conductivity Graphs Fig. 1 Heat Vein Fig. 2 Heat Slab [John Dixon] [COM] 4

  5. Copper Sink Properties [John Dixon] [COM] • Copper Slab • 0.03m thick X 0.065m wide X 0.08m long • Volume: 0.000156 m^3 • Copper Vein • 0.02m height X 0.065m wide X [0.001:0.372]m thick • Volume(max distance) = 0.000677 m^3

  6. Bibliography [John Dixon] [COM] Hyder, A.K.; Wiley, R.L.; Halpert, G.; Flood, D.J.; Sabripour, S. Spacecraft Power Technologies. (pp. 415-449). null. Online version available at: http://knovel.com/web/portal/browse/display?_EXT_KNOVEL_DISPLAY_bookid=1310&VerticalID=0 Watson, Richard D.; Chapman, Kirby S. Radiant Heating and Cooling Handbook. (pp. 5.1-5.13). McGraw-Hill. Online version available at: http://knovel.com/web/portal/browse/display?_EXT_KNOVEL_DISPLAY_bookid=1631&VerticalID=0 Griffin, Michael D.; French, James R. Space Vehicle Design (2nd Edition). (pp. 9.2 - 9.5). American Institute of Aeronautics and Astronautics. Online version available at: http://knovel.com/web/portal/browse/display?_EXT_KNOVEL_DISPLAY_bookid=1597&VerticalID=0 Steinberg, Dave S. Cooling Techniques for Electronic Equipment (2nd Edition). John Wiley & Sons. Online version available at: http://knovel.com/web/portal/browse/display?_EXT_KNOVEL_DISPLAY_bookid=2196&VerticalID=0 5

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