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SELEX GALILEO SPACE Line of Business Major Technologies and Facilities. May 2008. From Officine Galileo to G alileo A vionica. Since 1864. Plant of Hedquarters. Background information. Two major Product lines for space : Attitude Sensors Mission Payloads
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SELEX GALILEO SPACE Line of Business Major Technologies and Facilities May 2008
FromOfficine Galileoto Galileo Avionica Since 1864 Plant of Hedquarters
Background information • Two major Product lines for space : • Attitude Sensors • Mission Payloads • Wide range of key technologies: • Optics • Structural mechanics and thermics • Mechanisms • Detection Electronics • Digital Processing Electronics & SW • Recognised Leadership: • World Leaders in Attitude Sensors • National and European Leadership among Equipment Suppliers for Electro Optical payloads.
Design technologies = ERICA : 3^ generation of IR camera for ground applications Design technologies • thermo - mechanical design capabilities & tools • optical design capabilities & tools • electronics design capabilities & tools
Thermo-mechanical design capabilities & tools Mechanical design of high stable optomechanical structure Using CATIA v. 5 AUTONOMOUS STAR TRACKER
Thermo-mechanical design capabilities & tools Mechanical design of integrated electro-optical instruments involving thermo-mechanics, electronics, optics. ALADIN OPTICALBENCH
Thermo-mechanical design capabilities & tools Mechanical design of microgravity experiment for fluid science Using CATIA v: 5 FLUID CELLS FOR FASTER EXPERIMENT (interfacial surface tension measurament)
Thermo-mechanical design capabilities & tools VIRTIS STRUCTURE Structural analysis for static and dynamic verification using ANSYS or PATRAN / NASTRAN
Thermo-mechanical design capabilities & tools Thermal design and analysis using ESARAD or THERMICA for radiative coupling and ESATAN for temperature evaluation ASTR THERMAL MODEL
CODE V Optical Resarch Associates PROGET Galileo Avionica Software ZEMAX Focus Software Optical Design SWs Optical design capabilities
Optical design capabilitiesStray Light Analysis ASAP - BRO From ray-tracing to energy distribution on the Focal Plane
Optical design Simulation of Structural Deformations STEP 1 FEM CODE Stressed surface coordinates files for each surface STEP 2 STEP 3 FITTING PROGRAM Stressed surface coefficients file for each surface third analytical tool OPTICAL MODEL Optical analysis of system (WFE zernike coefficient – encircled energy …)
Electronic design capabilities Digital electronics and software • From requirement definition to the preparation of manufacturing documents • Includes the component selection, the preparation of design justification files and analyses (reliability, FMECA, part stress analysis, worst case analysis, …) • Competencies for the full sw life-cycle, from requirements to validation, including the design and test documentation, according to ESA PSS 05-0 or ECSS E40 Distintive capabilities on Microelectronics and Software • Space application: radiation tolerant design of hardware, design and development of complex FPGAs and ASICs, also for space application, and CPU-based electronic equipment/boards (Leon, ERC32, DSP21020, …) • Software capabilities range from hard real time embedded designs to workstation-based test equipment. The standard sw design flow is supported with specific tools (requirements, tests, quality measurements,…).
Electronic design capabilities Electronics of Autonomous Star Tracker ACC4KDX ASIC
Electronic design capabilities • ASIC design • IRES project (Scan logic and pitch & roll computing) • (25Kgates ASIC,1.2um for the first release, 0.6um for the second release,1MRad) • CASSINI project (Stellar Reference Unit Logic) • (20Kgates ASIC, 0.6um, 1MRad) • XMM project (Star Tracker logic) • (35Kgates ASIC, 0.6um, 1MRad) • SETIS project (Autonomous Star Tracker Logic) • (90Kgates ASIC, 0.5um, 35 KRad) • ROSETTA project (Autonomous Star Tracker and Camera Logic) • (135Kgates ASIC, 0.5um, 100 KRad) • A - STR project logic (A-STR) • (360Kgates ASIC, 0.5um, 100 KRad) • Digital Sun Sensor project (APS scan and pixel elaboration) • (115Kgates ASIC, 0.5um, 100 KRad)
Electronic design capabilities SW DESIGN CAPABILITIES SW DESIGN METHODOLOGY • Requirements: structured analysis • Architecture: HOOD, UML SW DESIGN TOOLS • Requirement definition: Innovator • Architecture design: HOOD- Nice, UML • Development: ADSP21000, ERC32CCS, LEONCCS, TLDADA • Operating systems: Virtuoso (for 21020), Rtems (for ERC32) • SW configuration: MKS • Unit and Integration testing: Cantata, AdaTest LANGUAGES: Ada, C (C++ for EGSE/Test equipment)
FPA & proximity electronics capabilities • Visible and IR detector procurement specification • Low Noise Electronics with high reliability for space applications STR FPA VIRTIS-Rosetta IR FPA VIRTIS-Rosetta VIS FPA – 512x512 px
Cryo techniques CryoTechniques • QSS Electronic for ISO (3 K) • Planck HFI proxy Electronics • VIRTIS Spectrometer (70 K) • MIMR cryo calibrator (70 - 300 K) • SiC mirrors cryogenic Tests
Precision mechanisms capabilities • Mechanisms • Scan and Pointing Mechanisms • Interferometer Mechanisms • Linear and rotating Actuators • TribologySpecial requirements: • long operating life (up to 7 years) • very high operation capability (tens of million operations) • dry lubrication (vacuum operation) • high accuracy (exact re-positioning) Hypseo Pointing Mechanism(with optical encoder)
Detectors characterisation VIS and IR detector Characterisation (from UV to 14m) with different set-up, at ambient and cryogenic temperatures CCD test bench CCD cryogenic set-up
Mechanical production Mechanical Workshop Environmentally controlled room 20° ± 1°C spatially and over 24 h.
Mechanical production Electro Discharge Machine Mod. Robofil 330 F (Charmilles Tec.) Boring machine Hydroptic 6 A Accuracy axes x y z : ± 2 µm. N° 5 axes CNC Machining Centre
Optical production Optical Workshop • Area: 2000 m2 • Manpower: 30 people • over 90 optical machines • 3500 optical masters and relevant tools • All kinds of glasses, electro-optical materials, metals, ceramics, SiC etc. Conventional Polishing technology Automatic high speed grinding & polishing machines
Mirrors polishing Mirrors Polishing
Lenses, mirrors up to 600 mm dia. Prisms, from 3 to 350 mm, 2 arcsec Materials: glass, germanium, metals, SiC Single Point Diamond Machining up to 300 mmfor: TMA Telescopes Spectrometers (prism or grating) Optical products SiC Mirrors SiC (320x200 mm)
Vacuum technology Galileo Avionica – Site of Carsoli Center of excellence for vacuum technologies applied to material surface treatment • Optical treatments / coatings • Hardwearing treatments • Functional treatments • Micronic photolitography • Industrial process development • Electronic microscopy
Optical production: coating facilities • Vacuum Technology Unit (Carsoli, AQ) • Custom optical coatings for military, space and industrial equipment & applications. • ISO / MIL standards qualified. • N. 8 Vacuum Chambers up 750 mm dia. in Clean Room of about 300 m2 • UV-Vis-Nir-Mir ranges • Antireflection Coatings • HR Dielectric & Metallic Mirrors • Dielectric & Metallic Beam Splitters • Dichroic Filters • Diamond Like Carbon A/R on Si & Ge
Optical production: coating facilities • Special developments • Coating on plastics optics; • Low temperature PE-CVD deposition process for the realization of Cladding Layers (i.e.: super-polishable SiC layers for SiC mirrors )
Optical production Diamond Machining Facility (mod. Pneumo-Nanoform-300) for I.R. & visible optics, metal mirrors, diffractive optics
Optical production Aspherical figuringwith on-line interferometric setup
Optical production Medium size ground telescope Primary Mirror
Optical production Silicon Carbide Mirrors Foamed sandwich substrates in SiC ( < 10 Kg/m2 technology) 320 mm Monolithic SiC (CP) for high efficiency space optics (15 Kg/m2)
Optical benches in Aluminium & Titanium Carbon fiber Structures Optical production: materials & structures 500 mm telescope Carbon fiber structure TMA Telescope, 150 mm aperture (Carbon fiber structure)
Optical production Ion Beam Figuring(co-operation with INAF Brera - I) Max size : 500 mm 170 mm SiC mirror: Before correction: 22 nm After correction: 8 nm
Assembly and integration Area: 300 m2 clean rooms (100 to 100.000 class)
Assembly and integration: testing equipment • Optical-Metrological Lab.s • Cleanliness Control • Laboratory • 1000 m2 clean rooms(Class 100 -100.000)
Assembly and integration: testing equipment • Interferometers:Wyko 6000, Zygo MarkIV, Kugler, Moeller Wedel, In-house developed) • Spectro-photometers • MTF control benches • CGH testing set-up • Microprofilometers(NewView 5000, WyKo Topo3D) • Collimators(up to 300 mm aperture)
AIT/AIV: intermediate testing Space & E/O facilities: Intermediate Testing
AIT/AIV: T/V Space & E/O facilities: Thermal Vacuum
AIT/AIV: cryo testing CRYOTESTon SiC mirrors for NIRSpec
AIT/AIV: EMC testing Space & E/O facilities:Anechoic Chamber(EMI Testing facility)
AIT/AIV: vibration testing Space & E/O facilities: Vibration Test
Test setup for attitude sensors • Final Test Facilities for Attitude Sensors • Galileo leadership in attitude sensors is based on solid expertise and capabilities for the Assembly, Integration and testing (calibration and characterisation) of electro-optical sensors, achieved through top class set-ups “validated” through the feedback of in-flight data.
Test setup for attitude sensors Space & E/O facilities:A-STR EGSE and Simulated sky in dynamic conditions