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MicroTCA.0 to MicroTCA.4: A standard and it's evolution

MicroTCA.0 to MicroTCA.4: A standard and it's evolution. xTCA Specification landscape. Defense. Industrial, Test & Measurement, Transportation. Telecom. Data Center. AdvancedTCA. Including dot-specifications PICMG 3.1 – 3.6. MicroTCA. MTCA.1 Air Cooled Rugged MicroTCA. ATCA 300.

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MicroTCA.0 to MicroTCA.4: A standard and it's evolution

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  1. MicroTCA.0 to MicroTCA.4: A standard and it's evolution

  2. xTCA Specification landscape Defense Industrial, Test & Measurement, Transportation Telecom Data Center AdvancedTCA Including dot-specifications PICMG 3.1 – 3.6 MicroTCA MTCA.1 Air Cooled Rugged MicroTCA ATCA 300 MTCA.3 Hardened Conduction Cooled MicroTCA Abandoned MTCA.4 Enhancements for Rear I/O and Precision Timing MTCA.2 * Hardened Air Cooled MicroTCA xTCA for Physics* ATCA Extensions * standardized Zone 3 connector Timeline * Work in process

  3. Advanced Mezzanine Cardthe base for MicroTCA Carrier Blade in an AdvancedTCA chassis AdvancedMC Modules Carrier Blade The AdvancedMC Modules are defined as Mezzanine Cards for the use on special AdvancedTCA Blades, called AdvancedMC Carrier, within the AdvancedTCA System.

  4. MicroTCA (MTCA.0)„Micro Telecommunications Computing Architecture Base Specification“ AdvancedMC in MicroTCA Systems AdvancedMC Modules MicroTCA Subrack The Advanced Mezzanine Card is plugged directly into the MicroTCA Subrack or System. The AdvancedMC is converting from a hook-on module to a functional board

  5. MicroTCA = standalone solution of AdvancedMC • New standard platform • Backplane directly accepts AdvancedMC modules • AdvancedMC interchangeable between AdvancedTCA and MicroTCA • Subracks fits into 300mm deep ETSI racks • No rear I/O, power input and all moduls will be inserted from the front side • New dimensions (not 3U / 6U anymore), card depth 180mm (instead of 160 / 220 / 280 mm)

  6. Full-size = 6 HP Mid-size = 4 HP Compact = 3 HP Double = 148.8 mm Single = 73.8 mm AdvancedMC Module dimensions 6 different Module sizes: • „Height“: Compact, Mid-size, Full-size • „Width“: Single and Double

  7. Management: List of standards MicroTCA Specification AdvancedMC Specification AdvancedTCA Specification IPMI Specification I2C-bus Specification

  8. Physical Management Controllers MicroTCA Shelf MCMC • MicroTCA Carrier Management Controller • Resides on the MCH MMC • Module Management Controller • Resides on the AdvancesMC Module EMMC • Enhanced Module Management Controller • Resides on the PMs and CUs MicroTCA Carrier MCH MCMC Backplane MMC MMC EMMC EMMC MMC Cooling Unit Power Module AMC 1 AMC 2 AMC 12

  9. Carrier-FRU SEEPROM Management Buses MicroTCA Shelf IPMB-L • Connects the MCMC on the MCH to the MMC on the AdcanvecMC Modules • Radial architecture IPMB-0 • Connects the MCMC on the MCH to the EMMC on the PM and CU • Bused architecture I2C-bus • Connects the MCMC on the MCH to the Carrier FRU EEPROM on the backplane MicroTCA Carrier MCH MCMC IPMB-L I2C-bus IPMB-0 Backplane MMC MMC EMMC EMMC MMC Cooling Unit Power Module AMC 1 AMC 2 AMC 12

  10. Carrier-FRU SEEPROM MicroTCA Management Structure Shelf Manager System Manager Carrier Manager • Resides on the MCH • Enables power to the AdvancedMCsvia the PM • E-keying Shelf Manager • Resides either on the MCH or external to the shelf • Maintains SEL (System Event Log) • Fan control System Manager • Highest level management function • Manages one or more MicroTCA Systems Each FRU’s (Field Replaceable Unit) equipped with a management controller All FRU’s connected via IPMI (Intelligent Platform Management Interface) MicroTCA Carrier MCH Carrier Manager MCMC IPMB-L I2C-bus IPMB-0 Backplane MMC MMC EMMC EMMC MMC Cooling Unit Power Module AMC 1 AMC 2 AMC 12

  11. MicroTCA Power Module (PM) and Cooling Unit (CU) • The MTCA Power Module is involved into the Carrier Management • Enables Management and Payload power to each slot individually • Decision for enabling / disabling power is done by the MCH (Carrier Manager) • The MTCA Cooling Unit is controlled by the MCH (Shelf Manager) too • Sets different fan speed levels on the request of the MCH (AMC: temperature event -> MCH -> MCH command to CU to increase fan speed) Power Module Cooling Unit Power Module

  12. -48V Powering up a MicroTCA Shelf Autonomous mode Booting Operational CU ♥ ♥ MP PP Pres. IPMB-0 Enable IPMB-0 Booting Operational Autonomous mode Booting Operational MCH PM X

  13. Operational FRU-ID FRU-ID FRU-ID AMC -48V Powering up a MicroTCA Shelf Operational CU ♥ ♥ MP PP I2C Pres. IPMB-0 IPMB-L Enable IPMB-0 Operational MMC operational Operational MCH PM X

  14. MicroTCA Connector and Backplane • Data transport is based on switched fabrics (serial data transfer) • Connector: 170 pin Card Edge • Component side 1 is left!! • Supported protocols: GbE, 10GbE, SRIO, PCIe, S-ATA, SAS

  15. Backplane Topologies (Connection Schemes) MicroTCA Specification defines a Star and a Dual Star Backplane, other topologies often requested by customers Examples “low cost” MicroTCA Chassis with direct interconnects Dual star MicroTCA Chassis with direct interconnects on port 2 &3 and in the fat pipe

  16. MicroTCA Backplane Technology • Bandwidth: shall support up to 12,5Gbps, today’s “speeds” per lane • PCIe I 2,5Gbps • GbE 1,25Gbps (“-KX”) • 10GigE 3,125Gbps (“-KX4”) • SRIO 1,25; 2,5 & 3,125Gbps • Aggregated Bandwidth per link: 4 * data rate per lane • Near Future “speeds” per lane • PCIe II 5,0 Gbps, PCIe III 8,0 Gbps • 10GigE 10Gbps (IEEE802.3ap, -KR) • SRIO  5 - 6Gbps

  17. MicroTCA Carrier Hub (MCH) Tongue 1: Common Options interface, IPMB connections Tongue 2: Common Options, Clocks Tongue 3, 4: Fat Pipe and Extented Fat Pipe connections

  18. Thermal requirements for a MicroTCA System • Different Power losses defined: • MTCA.0 R1.0  Single Compact = 20 W Double Compact = 40 W • Single Full-size = 40 W Double Full-size = 80 W • AMC.0 R2.0  Single Compact = 24 W Double Compact = 48 W • Single Mid-size = 30 W Double Mid-size = 60 W • Single Full-size = 48 W Double Full-size = 80 W • The maximum ambient temperature is defined at 55°C • The allowed temperature increase within a slot is ΔT = 10 Kelvin • One slot can be a several AMC modules in a row • (1) + (2) + (3) = one slot • Double FS + Single FS + Single FS • 80 W + 48 W + 48 W = 176 W 3 2 1

  19. Rugged MicroTCA • The Rugged Micro Telecommunications Computing Architecture specifications define the requirements for a System that meets more stringent levels and cycles of temperature, shock, vibration, and humidity than those defined in MicroTCA.0. • MTCA.1 (Air Cooled Rugged MicroTCA): this first sub-specification of MicroTCA describes rugged air-cooled systems for industrial applications. • MTCA.2 (Hardened Air Cooled MicroTCA): the second sub-specification of MicroTCA; it describes rugged air-cooled systems for military applications. • MTCA.3 (Hardened Conduction Cooled MicroTCA): the third sub-specification of MicroTCA; it describes rugged conduction-cooled systems for military applications

  20. MTCA.1 Shock & Vibration requirements Thermal requirements : 3 different Levels: Ambient (MicroTCA.0) and 2 Extended Temperature ranges XT1 & XT1L MicroTCA.0: - 5°C to + 55°C XT1L: - 40°C to + 55°C XT1: - 40°C to + 70°C Additional requirements: Drop test, RoHS, Acoustic, Surface temperature are defined as application specific For other requirements like Earthquake, Flammability, Atmospheric, Module insertion cycles, ESD, EMC, Safety MTCA.1 refers to the MTCA.0 base specification

  21. additionalretentionscrew front panel with flange Solution • AdvancedMC front panel has to be fastened (screwed) to the subrack MTCA.1front panel( XR2 ) AdvancedMC.0front panel

  22. Issues using a normal screw Face plate deflection When the Rugged MicroTCA Module is screwed to the subrack… F … the face plate will be deflected… … and the force will be applied to the connector. The module bare board and the connector bottom side will be stressed. F Conclusion: A locking method is needed, that fixes the module in the chassis in position without applying force into direction of the connector. F

  23. Solution Gap 0.0 mm Maximum gap ( 1.60 mm )* MTCA chassis Front panel flange Sleeve welded onto front panel 1.60 Collet Welded sleeve * Based on 185,85 subrack depth Screw M3

  24. MicroTCA Evolution (Rugged MicroTCA) • MicroTCA.2 (work in process) - Hardened air Cooled MicroTCA • For Telecommunication outdoor and military air, land and sea applications • Clamshell System similar to MicroTCA.3, similar shock & vibration demands • Conduction Cooling, Heat path: From the hot spots though thermal paste to clamshell and through Card-LOK to the chassis • Wedge-LOK is blocking the air flow • Special retainer solution is needed allowing forced air flow through heat sinks

  25. MTCA.3 Hardened Conduction Cooled MicroTCA • Specification approved Febr 2011 • For Telecommunication outdoor and military air, land and sea applications • 5 ruggedization levels with up to 15g vibration and up to 40g shock • Standard AMC board in a clamshell • it hardens the Boards • protects the active circuits of the PCB from ESD damage, supports Two Level Maintenance / 15KV ESD Protection • provides a thermal conduction path to the Thermal Interface Surfaces of the Chassis Sidewall

  26. MTCA.3 (Hardened Conduction Cooled MicroTCA) • Demands other kind of chassis • The chassis must have slots to hold the boards with wedge-loks • The chassis must be able to emit the heat to the surrounding air

  27. MicroTCA.4 - Enhancements for Rear I/O and Precision Timing • The advanced Physics community has made the decision to use AdvancedTCA and MicroTCA in their next generation of systems • Today their platform is VME • Main Reason for the change: • Remote management, failure detection of FRU’s (fans, PSU’s, Blades) • The AdvancedTCA & MicroTCA Specification need some adoption to fit the needs of the community • This was the reason for starting the working group “xTCA for Physics” inside the PICMG The Large Hadron Collider, Cern Karlsruher Tritium Neutrino experiment KATRIN

  28. MicroTCA.4 • Why are enhancements needed to the existing MicroTCA specification? • No Rear Transition Module (RTM) for MicroTCA defined • Physics applications typically require a large number of I/O cables. It makes sense to connect them to the rear of the chassis. • Special clock and trigger topology • MicroTCA.0 specifies 3 Clocks and AMC.0 R2.0 specifies 4 Telecom and 1 Fabric Clock on the AMC Module. Physics / measurement applications typically need additional Clocks and Triggers

  29. AMC µRTM MicroTCA.4 • Requirements for mechanics and sizes • AMC Module size: Double Mid-size • Allows for the max number of 12 AMCs in a 19” wide shelf • Large µRTM real estate • µRTM size approximately the size of the AMC (doubles depth of existing MicroTCA chassis) • Use front panel mechanics based on Rugged MicroTCA • Use Rugged MicroTCA retention device • Reuse existing AMC front panels for the µRTM • Optional zone 3 backplane

  30. µRTM handle, is at the top of the µRTM (µRTM front panel appears up side down) Safety keying, 8 positions 3-pair ZD connector (2 x 30 diff. pairs) µRTM AMC Rear Front Space for mounting mezzanine boards Could be used for clock and trigger distribution Retention device (defined in Rugged MicroTCA spec.) AMC card edge connector Retention device (defined in Rugged MicroTCA spec.) xTCA for Physics Features of a MicroTCA shelf with RTM, side view

  31. MicroTCA Shelf MicroTCA Carrier MCH MCMC IPMB-L IPMB-0 Backplane MMC MMC MMC EMMC EMMC Cooling Unit Power Module AMC 1 AMC 2 AMC 12 I2C-bus µRTM Cooling µRTM 1 µRTM 2 µRTM 12 MicroTCA.4 • Management extensions required for Physics I2C-bus • Connects the AMC to the µRTM • The µRTM is treated as managed FRU of the AMC • µRTM fans can be independently managed

  32. Backplane Topology, 23005-463 12Slot Dual Star Common Options MCH1 Fabric [A] to AMC Port 0 Common Options MCH2 Fabric [A] to AMC Port 1 • Differences MTCA.0 / MTCA.4 backplane topology • Direct S-ATA slot interconnects (used in most MTCA.0 systems too) • Special slot to slot interconnects (star & daisy chain routing) on user defined ports 12 to 15 • Parallel bus structure on user defined ports 17 to 20 AMC Port 2 AMC Port 3 4 Fat Pipe MCH1 Fabric [D:G] to AMC Port [4:7] 4 4 4 4 4 4 4 4 4 4 4 Extend. Fat Pipe MCH2 Fabric [D:G] to AMC Port [8:11] 4 4 4 4 4 4 4 4 4 4 4 4 AMC Port 12 AMC Port 13 AMC Port 14 AMC Port 15 AMC Port 17 AMC Port 18 AMC Port 19 AMC Port 20 Clocks MCH1 CLK1 to AMC TCLKA Clocks MCH2 CLK1 to AMC TCLKC Clocks AMC TCLKB to MCH1 CLK2 Clocks AMC TCLKD to MCH2 CLK2 Clocks MCH1 CLK3 to AMC FCLKA PM02 AMC01 AMC02 AMC03 AMC04 AMC05 AMC06 AMC09 AMC10 MCH02 PM03 MCH01 AMC07 AMC08 AMC11 AMC12 PM04 PM01

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