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Corporate Overview

Corporate Overview. www.atmel.com. Everywhere You Are . Corporate Mission. To be an industry - lead ing supplier of advanced integrated circuits (ICs). Atmel is an industry leader in ICs for Smart Cards and secure Point-of-Sale Terminals. Technology Integration. MCU. NVM. Complete .

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Corporate Overview

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  1. Corporate Overview www.atmel.com Everywhere You Are 

  2. Corporate Mission To be an industry-leadingsupplier of advanced integrated circuits (ICs) Atmel is an industry leader in ICs for Smart Cards and secure Point-of-Sale Terminals Corporate Overview

  3. Technology Integration MCU NVM Complete System Solutions Analog & RF Corporate Focus Atmel focuses on System Solutionsbuilt around: • High-performance Microcontrollers (MCU) • Embedded Non Volatile Memories (NVM) • Radio Frequency (RF) • Analog • Security … to maintain leadership in key markets, including: • Flash Microcontrollers • #1 in 8-bit Flash microcontrollers • Secure Systems • #2 in secure ICs for smart cards • Automotive Corporate Overview

  4. Application Code Modules Operating Systems Protocol Stacks Device Drivers Nonvolatile Memory Sensor Micro- controller RF Analog Power Manage-ment Logic Application Support In partnership with applicationleaders, Atmel supplies: • Device Driver Software • Protocol Stacks • Operating Systems • Compilers • Application Code Modules • Development Tools • Reference Designs … to simplify application development Application-ready System Corporate Overview

  5. Everywhere you are  Wide Application Focus Atmel aims its products at a wide range of applications in high-growth markets: • Consumer • Computer/ Networking • Communications • Security/ Smart Cards • Automotive • Industrial/ Medical/ Military/ Aerospace Market Diversity Corporate Overview

  6. General-Purpose Application-Specific Non Volatile Memories Flash DataFlash® EEPROM/ Serial EEPROM Microcontrollers 80C51 (8-bit CISC) AVR®(8-bit RISC) ARM®(32-bit RISC) AVR32 (32-bit RISC) High-reliability MCUs (32-bit Power PC) Diopsis™ (Floating Point VLIW DSP) ASICs Customer Specific ASICs Rad. Hard ASICs FPGA Conversion (ULC) Secure Solutions Secure MCU Contactless Card Secure Memory CryptoMemory® Smart Card Reader RFID Trusted Platform Module Biometric ICs FingerChip® Communications Solutions ZigBee RF Products GSM/CDMA Cell Phone GPS Chipset Cordless Phone Analog/DigitalAudio Broadcast Car Access Tire Pressure Metering RF Remote Control License Free Industrial & Consumer ASSPs USB GPS Baseband Power Management Broadband Data Conversion Multimedia ICs Voice-over-IP (VoIP) Storage Interface Sound Processing (Dream™) MP3 Player DVD/CD Writer/Player Video Automotive ICs CAN / LIN Networking Automotive Sensors Driver ICs Watchdog ICs Single-function ICs Imaging ICs CCD/CMOS Image Capture Image Processors Integrated Digital Camera Module Common IP Blocks:MCU/DSP Cores & Peripherals, Standard Interfaces, Analog, Power Management, Embedded Nonvolatile Memory, RAM, ROM Foundry Services:SiGe Bipolar/BiCMOS, BCDMOS/BCD-on-SOI, CMOS Product Lines Corporate Overview

  7. Fabrication Processes Atmel develops advanced fabricationprocesses precisely adapted to its products: • CMOS • High-performance digital and analog • CMOS with Non Volatile Memory • Embedded EEPROM and Flash memory • BCDMOS and BCD-on-SOI • High-voltage, high temperature and high noise immunity for automotive applications • Silicon Germanium (SiGe) Bipolar and BiCMOS • High-frequency RF interfaces Leading-edge semiconductor fabrication processes Corporate Overview

  8. www.medea.org www.cordis.lu/ist www.eureka.be Research & Development Atmel participates in Collaborative R&D Projects for: • Leading-edge Technologies • Non Volatile Memory and Embedded NVM • Nanoscale CMOS technology and fabrication processes • Next-generation SiGe technology • Advanced Design, Fabrication and Packaging Techniques • Next-generation Products • Wireless Sensor Networks • Secure Communication Solutions • Multi-standard Broadcast Receivers • Long-range RF Identification (RFID) Products Partnership with Universities, Research Labs and Market-leading Customers Corporate Overview

  9. Facilities 8000 employees worldwide • San Jose, USA • Corporate Headquarters, Test, R&D • Colorado Springs, USA • 0.25-micron 6-inch Wafer Fab, Test, R&D • Rousset, France • 0.13-micron8-inch Wafer Fab, Test, R&D • Heilbronn, Germany • 0.5-micron6-inch SiGe/ Bipolar/ BiCMOS/ BCDMOS Wafer Fab, Test, R&D • North Tyneside, England • 0.13-micron 8-inch Wafer Fab, R&D • Grenoble, France • CCD Fab, Assembly, R&D • Philippines • Assembly, Test • 27 Design Centers • Berkeley, Colorado Springs, Columbia, Raleigh, San Jose, Chicago, Camberley, East Kilbride, North Tyneside, Helsinki, Stockholm, Trondheim, Semur-en-Auxois, Grenoble, Nantes, Paris, Rousset, Lisbon, Milan, Patras, Duisberg, Dresden, Heilbronn, Ulm, Bucarest, Shanghai, Tokyo • 22 Sales Offices Worldwide Atmel Corporate Headquarters, San Jose Atmel also uses fabrication sub-contractors to ensure the best technology mix in its products Corporate Overview

  10. Automotive Products 5% Non Volatile Memory Mixed Signal ASSPs 22% 9% ASICs 13% Microcontrollers Secure Products 20% 14% RF Wireless ASSPs 17% Revenue Split by Product Category Atmel Product Revenues 2005 Corporate Overview

  11. Revenue Split by Region Atmel Product Revenues 2005 Corporate Overview

  12. High-volume, high-integration, low-cost, low-power-consumption ASSPs and ASICs Consumer Applications Applications: • DVD and MP3 Players • Music Synthesis/Karaoke • Electronic Games • AM/FM and Digital Radios • TV/Video, White Goods • Digital Cameras Products: • DVD Chipset and Laser Controller ICs • ISM-band Radio Link ICs • Image Sensor / Processor ICs • MP3 Decoder • Dream™ Sound Synthesis ICs • ARM®-based 32-bit Microcontrollers • AVR® 8-bit and 32-bit Microcontrollers • AM/FM Receivers and Amplifiers • DAB Receiversand Decoders • TV/Video ICs • IR Remote Receiver ICs • Power Management ICs Corporate Overview

  13. Highly integrated analog/digitaland RF Systems-on-Chip Communications Applications Applications: • GSM/GPRS/CDMA/UMTS Mobile Phones • Cordless and Corded Phones • Secure Mobile Radios • Global Positioning System (GPS) • Personal Locators • Infrastructure Systems Products: • GSM/GPRS Baseband Processor • RF Transceivers, Power Amps and Front-end ICs • RF Standard Building Blocks • Cordless and Corded Phones ICs • GPS Receiver and Baseband ProcessorChipset • Miniature Digital Camera Modules • ARM®-based Std Products, ASSPs and ASICs • Power Management ICs Corporate Overview

  14. Market-leading products conforming to stringent automotive industry standards Automotive Applications Applications: • Vehicle Body Electronics • Vehicle Access • Power Train Management • Telematics (Navigation) • Entertainment (Car Radio, Car Media) • Tire Pressure Metering Systems (TPMS) Products: • Sensors (Rain Sensor) • Vehicle Network/Multiplexing (CAN, VAN, LIN, etc.) • GPS Receiver and Baseband ProcessorChipset • Receivers for Analog and Digital Broadcast Systems • ICs for Wireless Control (Keyless Entry, etc.) • TPMS ICs • Smart Drivers and Intelligent Bridges • AVR® 8-bit and 32-bit Microcontrollers • Single-function ICs • Customized ASICs Corporate Overview

  15. Process Roadmap Process Roadmap 2003 2004 2005 2006 0.25 µm MCU Flash MCU Digital/Analog ASIC Digital/Analog ASSP Programmable Logic Flash CMOS Logic & Flash 0.18 µm 0.13 µm 0.09 µm Secure MCU EEPROM ASIC EEPROM ASSP EEPROM 0.25 µm CMOS Embedded EEPROM 0.18 µm 0.15 µm 0.35 µm RF RF ASSP Foundry SiGe- BiCMOS 0.18 µm 0.13 µm Corporate Overview

  16. Key Technology for RF Products Silicon Germanium (SiGe) 1 GHz 2 GHz 5 GHz 10 GHz GaAs SiGe Si GSM ISM DCSPCS DECT WLAN Blue-tooth RF Links PDC GPS WLAN ISM Corporate Overview

  17. Manufacturing Facilities: Germany/UK • Heilbronn, Germany • Process: SiGe, Bipolar, BiCMOS, BCDMOS • Wafer Size: 6-inch (150mm) • Technology: 0.5µm • Fabrication, Product R&D • North Tyneside, UK • Process: CMOS, SiGe BiCMOS, NVM, Smart Card Technologies • Wafer Size: 8-inch (200mm) • Technology: 0.18µm, 0.13µm • Usable Clean Room Area: 75,000 sq ft (7,500 sq m) • Fully Equipped Capacity: 10,000 wafers/week Corporate Overview

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