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This project focuses on the development of electronics for the SIPM-MU2e detector system, emphasizing front-end architecture optimization. It includes details on preamplifier and regulator schemes, power supply specifications, linear drivers, simulation results, and project status updates. The aim is to enhance the overall functionality and performance of the detector system through meticulous electronic design.
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Development electronicsSIPM-MU2e INFN-LNF G. Corradi 11/06/2016 giovanni.corradi@lnf.infn.it
Calorimeter routing DAQ room Detector Solenoid Floating LV +28V /negative Floating positive HV 230 V (MPPC) ground ~7-8 m overall cross section ~180 cm2 ~60-80 m overall cross section ~210 cm2 LV HV isolation OVP filter Detector Ground Safety Ground Floating Structures
Architecture front-end • Optimization of space • Cables and connectors
Preamplifier_SIPM Preamplifier Shaper filter Select Gain Select Pulse Test Differential Driver Linear Regulation • Electric preamplifier scheme
Preliminary Specifications Preamplifier • Gain Vout/Vin 2 step remote control 15-30 • Dynamic differential +/-1V • Bandwidth 40Mhz • Rise time 10ns • Output impedance 100 Ω • Stability with source capacity max 1nf • Coupling output end source AC • Noise, with source capacity 1pf --------- • Power dissipation 45mW • Power supply +8V • Semi-gaussian shaping filter 3 pole • Injection test pulse charging, fixed amplitude 400mV • Input protection 10mJ
Linear_ Regulator Linear Driver Driver Decoder ADC 16bit Linear low Voltage section I2C line DAC 16bit • Electric linear regulator scheme
Preliminary Specifications regulator • Vin max 250V • Current limit 2mA • Dynamic regulation 5V to 200V • Settling time 100us • Ramp-up programmable 1ms to 100ms • Ripple estimated 3mVpp • Stability Δt 10 °C better 50 ppm • Power dissipation with out load min 50 mW • Power dissipation max load, worst case max 350 mW • Temperature measurement -40 to 50°C • Monitor current detector 50uA to 2mA • Remote control I2C • GND insulated from earth Ceq max 5pf
PCB Layer TOP Preamplifier • Dimention card 58mm x 30mm
PCB Layer Bottom Regulator • 4 holes for heat transfer on the mechanics
Final Assemblay Thermal Contact By Bridge resistor • Thermal conducting • Power to dissipate max 350mW Board Temperature Sensor Output Connector Case (Cu)
Status and perspectives • Preamp-regulator, projectcompleted • Test, first week of june • Firmware developmentworking progress • Definition of the cables and interfaceconnectorsbetweenpreamplifier and controller • Project progress, primaryregulatorprototype 250V 40mA ( with knownmagneticfieldproblems) • Project progress, primaryregulatorprototype 8V 1A (sameproblemsasmentionedearlier) • Project and development controller ARM