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Lecture 21: Packaging, Power, & Clock

Lecture 21: Packaging, Power, & Clock

Lecture 21: Packaging, Power, & Clock. Outline. Packaging Power Distribution Clock Distribution. Packages. Package functions Electrical connection of signals and power from chip to board Little delay or distortion Mechanical connection of chip to board Removes heat produced on chip

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1.2k views • 83 slides
Design Economics

Design Economics

Design Economics. Design Economics. IC designer should able to predict the cost and the time to design a particular IC. This guides the choice of implementation strategy. Selling price S total = C total / (1-m) Where m = profit margin and C total = total cost

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987 views • 64 slides
EE4800 CMOS Digital IC Design & Analysis

EE4800 CMOS Digital IC Design & Analysis

EE4800 CMOS Digital IC Design & Analysis. Lecture 13 Packaging, Power and Clock Distributions Zhuo Feng. Outline. Packaging Power Distribution Clock Distribution. Packages. Package functions Electrical connection of signals and power from chip to board Little delay or distortion

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377 views • 37 slides
Introduction to CMOS VLSI Design Lecture 20: Package, Power, and I/O

Introduction to CMOS VLSI Design Lecture 20: Package, Power, and I/O

Introduction to CMOS VLSI Design Lecture 20: Package, Power, and I/O. David Harris Harvey Mudd College Spring 2004. Outline. Packaging Power Distribution I/O Synchronization. Packages. Package functions Electrical connection of signals and power from chip to board

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795 views • 25 slides
Introduction to CMOS VLSI Design Lecture 20: Package, Power, and I/O

Introduction to CMOS VLSI Design Lecture 20: Package, Power, and I/O

Introduction to CMOS VLSI Design Lecture 20: Package, Power, and I/O. David Harris Harvey Mudd College Spring 2004. Outline. Packaging Power Distribution I/O Synchronization. Packages. Package functions Electrical connection of signals and power from chip to board

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637 views • 25 slides
332:479 Concepts in VLSI Design Lecture 25 Packages and Power

332:479 Concepts in VLSI Design Lecture 25 Packages and Power

332:479 Concepts in VLSI Design Lecture 25 Packages and Power. David Harris and Mike Bushnell Harvey Mudd College and Rutgers University Spring 2004. Outline. Packaging Power Distribution Summary. Material from: CMOS VLSI Design , by Weste and Harris, Addison-Wesley, 2005. Packages.

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382 views • 21 slides

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