1 / 19

Outline: Introduction to LHCb and VE rtex LO cator (VELO) Status of VELO Beamtests Upgrades

LHCb Vertex Locator: present and future. Martin van Beuzekom On behalf of the LHCb VELO group. Liverpool University. Outline: Introduction to LHCb and VE rtex LO cator (VELO) Status of VELO Beamtests Upgrades Summary. LHCb overview. Large Hadron Collider

Download Presentation

Outline: Introduction to LHCb and VE rtex LO cator (VELO) Status of VELO Beamtests Upgrades

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript


  1. LHCb Vertex Locator: present and future Martin van Beuzekom On behalf of the LHCb VELO group Liverpool University Outline: • Introduction to LHCb and VErtex LOcator (VELO) • Status of VELO • Beamtests • Upgrades • Summary 1

  2. LHCb overview Large Hadron Collider pp collisions: √s = 14 TeV bunch crossing every 25 ns LHCb Studies physics of b-flavoured hadrons (CP violation) B-hadrons produced at small angles -> Single arm forward spectrometer 10 – 300 (250) mrad in bending plane (non bend.) Luminosity 2·1032 cm-2 s-1 interaction region 2

  3. Vertex Locator • 2 retractable detector halves • Range 3 cm each • 23 silicon microstrip modules / side • Silicon modules in secondary vacuum (2 mm) • Modules separated from beam vacuum (10-9) by 300 mm Alu foil (RF box) • Maximum allowed diff. pressure 5 mbar • Shield against beam induced EMI • Innermost strip 8 mm from beam 3

  4. Silicon sensor details R-measuring sensor (45 degree circular segments) • 300 mm thick sensors • n-on-n, DOFZ wafers • 42 mm radius • AC coupled, double metal • 2048 strips / sensor • Pitch from 40 to 100 mm • Produced by Micron Semiconductor 42 mm 8 mm F-measuring sensor (radial strips with a stereo angle) 4

  5. Module construction Beetle • 4 layer kapton circuit • Heat transport with TPG • Readout with 16 Beetle chips • 128 channels, 25 ns shaping time, analog pipeline • 0.25 mm CMOS • no performance loss up to 40 Mrad • Yield > 80 % Kapton hybrid Carbon fibre Thermal Pyrolytic Graphite (TPG) 5

  6. Silicon microstrip modules RF-foil VELO sensors PileUp sensors • 21 stations with R-F geometry • Fast R-Z tracking in trigger farm • Overlap of right and left det. halves • Total of 176k strips • 2 stations with R-sensor for PileUp trigger Carbon fibre base Fine pitch kapton cables 6

  7. Pile Up (veto) trigger n = # pp interactions/crossing • PileUp system detects multiple interactions • Vetoes Level-0 trigger • Increases physics output • Multiple interactions complicate Level-1 trigger (CPU-farm) • Factor 3 reduction in #crossings with multiple interactions • 2 R-sensors, prompt binary readout • Combine 4 strips in 1 to reduce # inputs • 2048 “bits” @ 40 MHz = 80 Gbit/sec • Special hybrids (4 times #signals) LHCb luminosity 7

  8. PileUp continued all combinations true tracks • Each vertex bin corresponds to a small wedge in the RA-RB correlation plot • Each “track” is represented by a point • Histogramming of Z-vertex • determine # vertices with FPGAs • find 1st peak, mask hits, find 2nd peak • Algorithm highly pipelined ( ~ 80 Bunch crossings) 2 vertices 8

  9. LHCb status Installation progressing, first collisions expected in fall 2007 9

  10. Status @ Interaction point • Vacuum vessel installed May 2006 • Vacuum controlled by PLC • Movement system controlled by PLC • Thin (2 mm) exit foil mounted in Aug 2006 • Vacuum qualification ongoing • Detector installation early 2007 10

  11. CO2 cooling • 2 phase CO2 cooling system • Low mass • Radiation hard • Non toxic • Silicon modules in parallel • 1 mm Ø stainless steel capillaries • Pressure up to 70 bar • Large DT over TPG + interface • heat load max. 30W T=-30 ºC T ~ -5 ºC 11

  12. Testbeam performance 2004: • Single sided module with 200 mm sensor • Characterized (final) sensor + (final) Beetle • S/N 16 • Spillover @25 ns < 25 % • Resolution ~4 mm Beetle Frontend pulseshape August 2006 • 3 double sided modules • Full electronics chain with final electronics • ADCs, Timing, Fast & Slow Control • Data taken for many sensor and chip settings • Analysis ongoing November 2006 • Aim for a complete detector half (21 mod.) • Module production in Liverpool at full speed • Delivery 4 modules per week • Major effort! 12

  13. VELO Upgrades Why: • Limited lifetime of VELO due to high radiation dose • (1.3x1014 neq/cm2/year) • Improve (impact parameter) resolution • Displaced vertex trigger • Increase statistics • Readout of complete LHCb detector @ 40 MHz How: • Different sensor technology/geometry • Reduce material in VELO • Move closer to beam • Currently 8 mm, goal 5 mm (min. allowed by accelerator) • Up to 36% resolution improvement • Increase luminosity (not SLHC) • Level-1 computing power 13

  14. Radiation environment Middle station Far station Radiation environment for current design • Strongly non-uniform • Dependence on radius and z-position • Max fluence 1.3x1014 neq/cm2/year Define as 1 LHCb-year • Expected (useful) lifetime ~3 years • assuming nominal luminosity • no accidents With upgrades • 5 mm strip radius -> 2.5x increase • Luminosity to 1x1033 -> 5x increase • Fluence 1.7x1015 neq/cm2/year Only possible with • Different sensor technology • and/or smaller strips or pixels (Syracuse group) 14

  15. Radiation Hard Technologies Magnetic Czochralski • p-on-n MCz • Assume required CCE min. 60 % • Single sided processing • R&D by Glasgow group 5..6 LHCb-years 15

  16. Radiation Hard Technologies- II n-on-p > 20 LHCb-years • High resistivity p-silicon • Single sided processing • Very high bias voltage • R&D by Liverpool group Presentation by Gian-Luigi Casse 16

  17. Radiation Hard Technologies- III 3D - sensors Extremely radiation hard Low bias voltage Very promising Complex processing R&D by Glasgow group 17

  18. Reduce material in VELO Radiation length of total VELO: 19 % X0 Largest contribution from RF-foil and sensors Thin sensors (200 mm) already tested extensively Thinner RF-foil is under investigation • BTeV planned sensors in primary vacuum • Beam (mirror) current via wires/strips • Cryo pumping against outgassing • Totem (@LHC) • 150 mm Inconel (Ni-Cr) foil 1 mm from beam 18

  19. Summary • Construction of LHCb VErtex LOcator is well underway • Mechanics, vacuum, motion system installed • Cooling system steadily progressing • Silicon module production at full speed • Next deadline is half detector for November testbeam • Detector (sensors) installation early 2007 • Already starting to think about upgrades • Limited lifetime of VELO • More radiation hard sensors • Reduce material to improve performance 19

More Related