1 / 1

Ruggedized High-Speed Camera Module

Ruggedized High-Speed Camera Module. Project Description Design and develop a camera system that can capture, package, and transmit high-speed still image and video data in a compact ruggedized housing which may be subjected to extreme cold, heat, and moisture-laden environments.

valora
Download Presentation

Ruggedized High-Speed Camera Module

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. Ruggedized High-Speed Camera Module Project Description Design and develop a camera system that can capture, package, and transmit high-speed still image and video data in a compact ruggedized housing which may be subjected to extreme cold, heat, and moisture-laden environments. • Specifications • Incorporate interchangeability between C-mount lenses, M12 Holder • w/ lenses, and M3F Focus Module w/ M12 lenses. • Shall be capable of transmitting full frame rate of 14 MP sensor. • Shall transmit data at a minimum of 2 Gbps over at least 10 feet of • cable. • Cable shall transmit power to camera. • Meets IP-64 Water Resistance, oil resistance and is ruggedized • Operating Temperatures: -40 F to 221 F • Max Dimensions: 1.2” X 1.2” X L P13571 Team Members: (from left to right) Jose Portugal (ME), Stephen Goss (CE), Peter Hood (CE), Cameron Staunch (ME), Andy Anthony (EE), and Stephen Brown (EE). [Faculty Guide: Adriana Becker-Gomez, Ph.D. (CE)] Mechanical Design • Fluorocarbon and Buna-N gaskets to ensure high temperature and • waterproof operation. • Copper cold finger, aluminum housing, and thermal foam to reduce • thermal resistance from FPGA circuit board to atmosphere. • FEA thermal analysis to ensure thermal reliability [S.F.=1.1] • Modal Analysis to ensure enclosure withstands vibrations from • high performance engines. • Anodized surface finish increased abrasion and corrosion • resistance, electrical resistance, while maintaining thermal heat • conductance. Software Circuit Board Design • Preliminary research led to the selection of CoaXPress, a • high speed serial communication standard for the • transmission of video and still images over coaxial cable. • An FPGA system design was created using Verilog to implement the • CoaXPress data transfer model. • Independent two stage design to capture and transmit data. • 32-bit CRC for data validation. 14 MP Image Sensor Board – Contains an OV14825 14.6 megapixel CMOS image sensor that can output raw pixel data in parallel format or MIPI-CSI-2 (a high-speed LVDS protocol in portable electronic devices). (Designed by D3) FPGA Board – Includes an Altera Cyclone IV GX FPGA that uses high-speed transceiver architecture to transmit data at speeds up to 2.5 Gbps. Also includes SPI Flash memory and 156.25 MHz LVDS oscillator. Power Distribution Board – Includes 2 switching power supplies (2.5V, 1.2V) and the M3F Focus module connector. Coax Board – Includes a 24V to 3.3V switcher and a data transmission circuit that adheres to the CoaXPress physical layer protocol. Sponsored by: Special thanks to: D3 Engineering (Scott Reardon (CEO), Jason Enslin, and Jim McGarvey), LightforceTechnology (Peter Hammond), Altera Corporation (Robert Spurr and Bill Jenkins), Coating Technology Inc., Dr. Antonio Mondragon, & the RIT Machine Shop Personnel.

More Related