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Status report on:

Status report on:. Module assembly procedure FPC-pixel chips interconnection. Module assembly procedure . A. B. New jigs. reference pins. New jigs. Module assembly procedure . Dummy chips: 50 µm thick size 15 mm x 30 mm Dummy FPC: Designed as in TDR1 to accommodate 7 x 2 chips

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Status report on:

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  1. Status report on: • Module assembly procedure • FPC-pixel chips interconnection

  2. Module assembly procedure A B New jigs reference pins New jigs

  3. Module assembly procedure • Dummy chips: • 50 µm thick • size 15 mm x 30 mm • Dummy FPC: • Designed as in TDR1 to accommodate 7 x 2 chips • holes metalized • no coverlay at the bottom • produced by Nuova Eurotar FPC layer stack up Cover-sheet 25 µm Copper 50 µm Kapton 25 µm Copper 50 µm First version of FPC

  4. Module assembly procedure X Y i2 i3 i1 i4 i5 i6 L Measures in mm CHIP 8 CHIP 1 CHIP 2 i1 i1 CHIP 1 CHIP 2

  5. Module assembly procedure B C A Carbon plate K13D2U 75gsm (≈ 40µ) 3 layers 0°/90°/0° Thickness 0,11-0,12mm Weight 1,22g L Measures in mm • Open questions: • Module carbon plate : yes or not • If yes, • higher precision • adhesive tape or glue?

  6. Module assembly procedure FPC pre-alignment and handling 1 2 3 4 A A

  7. Module assembly procedure Chips alignment respect to the FPC 5 7 A 6 A

  8. Module assembly procedure Gluing procedure to fix the FPC on the chips 8 Adhesive mask 9 10 11

  9. Module assembly procedure Accuracy of chips x,y position: < 8 um (average) Modules without carbon plate Chip: 15 mm x 30 mm 300 um thick Frontview Back view Modules with carbon plate Frontview Carbon plate K13D2U 75gsm (≈ 40µ) Thickness 0,11-0,12mm Weight 1,22g Back view

  10. Module assembly procedure FPC FPC 150 µm thick Chip 50 µm thick Carbon plate 120 µm thick Glue: Ecobond 40 µm thick Modules without carbon plate Modules with carbon plate Does the module plate help for handling and testing?

  11. Dummy FPC stack up FPC- pixel chips Interconnections Kapton 50 µm Aluminum 25 µm Collaboration with FBK/ Micro Technologies Lab, Italy and Kirana Sp Tab Bonding Next week Kirana will deliver 10 dummy FPC : 7 for us and 3 for Giacomo First test: laser tuned to remove Kapton up to the Al layer Second test

  12. Summary • The first 2 dummy modules with and without carbon plate were produced. Accuracy of chips x,y position: less than 8 µm (average). • By the end of the next week we will start the production of 7 dummy modules which will be useful to develop the stave assembly procedure. • Does the module plate help for handling and testing? • Next week Kirana will deliver 10 dummy FPC in polyimide (thickness 50 µm) laminated to aluminum foil (thickness 25 µm) : 7 for us and 3 for Giacomo.

  13. Back slide

  14. X Y i i i i i i L

  15. FPC- pixel chips Interconnections FOR GIACOMO

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