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Artemis ESA-OSA Buy-off. Objective. To evaluate Artemis modified machine on DEUCE EOSA assembly and whether it can achieve < 10um placement accuracy. Materials. Modified Artemis machine ( bond force 500g ) OSA and ESA Ag epoxy Techfilm 3213 LCR epoxy Optocast 3410 VM. LCR.
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Objective To evaluate Artemis modified machine on DEUCE EOSA assembly and whether it can achieve < 10um placement accuracy. Materials • Modified Artemis machine ( bond force 500g ) • OSA and ESA • Ag epoxy Techfilm 3213 • LCR epoxy Optocast 3410 VM LCR Dispensing Method Ag Epoxy Ag Epoxy LCR
TX Measurement Measurement Reference Point LENS Measurement Reference Center Aperture Set-up data
TX Data Distribution TX placement accuracy Passed spec of <10um placement accuracy.
TX Measurement Measurement Reference Point LENS Measurement Reference Point Mesa Set-up data
RX Data Distribution RX placement accuracy Passed spec of <10um placement accuracy.
BLT measurement reference Side 2 Reference points Side 1 BLT measurement location 1 2 3 4 5 Five points measurement per side
TX BLT Measurement RX BLT Measurement
Cross-Section View Thin bond line thickness with a measurement ranging from 6-12 um
Piece Part Planarity Un-even planarity of Cu block that resulted to inconsistent BLT
Delamination between Cu Block and L/F Insufficient epoxy application
Observation • Artemis modified machine can achieve < 10um on ESA to OSA placement accuracy. • Using 500g of bond force BLT can range from 5um to 20 um. • Inconsistent BLT was observed due to un-even planarity of piece parts. • Delamination between Cu and LF is observe due to insufficient epoxy application. ( manual dispensing )