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Lecture 12 Review and Sample Exam Questions

Lecture 12 Review and Sample Exam Questions. Professor Lei He EE 201A, Spring 2004 http://eda.ee.ucla.edu. Partitioning and Clustering. Formulations: min-cut, min ratio cut, two-way partition and N-way partitioning Kernighan and Lin Algorithm Fiduccia and Mattheyses Algorithm

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Lecture 12 Review and Sample Exam Questions

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  1. Lecture 12Review and Sample Exam Questions Professor Lei He EE 201A, Spring 2004 http://eda.ee.ucla.edu

  2. Partitioning and Clustering • Formulations: min-cut, min ratio cut, two-way partition and N-way partitioning • Kernighan and Lin Algorithm • Fiduccia and Mattheyses Algorithm • Simulated annealing algorithm • Lawler’s Labeling Algorithm • Overview of multi-level partitioning

  3. Floorplanning • Stockmeyer algorithm • Dynamic programming to decide optimal orientation for slicing floorplanning (i.e., tree for slicing floorplanning is given) • Simulated annealing algorithm to find slicing floorplanning • Name and explain at least one data structure for non-slicing floorplanning

  4. Placement • Simulated Annealing • Timberwolf package [JSSC-85, DAC-86] • Dragon (multi-level placement) [ICCAD-00] • Partitioning-Based Placement • Capo [DAC-00] • Fengshui [DAC-2001] • Analytical Placement • Gordian (Multi-level placement) [TCAD-91] • FastPlace [ISPD-04] • Able to outline Pro’s and Con’s of all above algorithms • Able to outline at least two algorithms

  5. Power and Thermal Modeling • Power Components • Dynamic power (f * s * C * Vdd**2) • f: clock frequency • S: switching possibility • Short circuit power • Leakage power = subthreshold + gate tunneling • Power trends • Relative significance between power components • Which one gains importance in scaled technology and future system • Design freedoms to reduce each power component with respect to performance constraints

  6. Power and Thermal Modeling • Duality between electrical and thermal • Thermal time constant is much bigger • Interdependency between leakage and temperature

  7. Interconnect Modeling • Capacitance characteristics and table based capacitance model • Capacitance is a local effect • Inductance characteristics and table based inductance model • Inductance is a long-range effect • Partial inductance (PEEC) is independent of current return path • Full RCLM model and normalized RCLM model

  8. Interconnect Delay Model • Elmore delay model and Elmore delay calculation for RC tree • Definition of moments and overview of moment matching • Ceff model • Steps of delay analysis for a stage containing a driver and interconnect tree

  9. Circuit Tuning • TILOS algorithm • Find critical path • Calculate sensitivity of each gate/transistor in the path • Size up the one with largest sensitivity • Goto step 1 • Explain why TILOS can achieve good solutions • Use the concept and property of posynomial program, convex program • Extend TILOS to consider power minimization via dual-Vdd, dual-Vt, dual-tox

  10. Buffer and FF Insertion • Analytical solution to buffer insertion for two-pin net • Extend to find the FF insertion length for two-pin net * • Van Ginneken dynamic programming • Extend to consider buffer type, polarity • Extend to consider FF insertion* • Buffer block planning • Key ideas, pro’s and con’s

  11. Noise Aware Routing • Design freedoms to alleviate capacitive and inductive crosstalk • Figure of merit for crosstalk • LSK model • Shielding length • Multi-level routing

  12. Emerging Technologies • Structured ASIC and 3D IC • Motivations and advantages • CAD implications • Sample questions: • How to expand partition/floorplan/placement/routing for 3D

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