1 / 11

Design

Design. Ash finished electric hybrid tracing to connector fields Changes to allow for HCC-less and HCC running on one hybrid awaiting final confirmation of HCC footprint Should come next week Power board work by Sam continuing Toroidal DC-DC and pararrel power boards ready for submission

zeheb
Download Presentation

Design

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. Design • Ash finished electric hybrid tracing to connector fields • Changes to allow for HCC-less and HCC running on one hybrid awaiting final confirmation of HCC footprint • Should come next week • Power board work by Sam continuing • Toroidal DC-DC and pararrel power boards ready for submission • Flat coil next on list • SP board (with SPP) needs details from Mitch

  2. Assembly Results So Far • Very positive results in gluing ASIC to hybrids and hybrids-to-sensor • One solid row of epoxy under ABC130, one dotted row under thermistor, HCC and hybrid-to-tape bonds • ~50% epoxy coverage with 100-120 mm thickness • Performed pickup trials with ABC130. • No visible marking under microscope Slide 2

  3. Minor Jig Issues Glue Stencil Chip Pickup Tool ABC130 Chip Pickup Tool Hybrid Sensor Epolite • All worked as well as expected but: • ASIC glue stencil tended to rock on single ASIC column, pumping too much glue onto ASIC • Epolite (sensor-to-hybrid) epoxy tended to push AWAY the hybrid from the sensors • Previously we were worried that the glue would pull the hybrid TOWARDS the sensors • Expect that skimming glue onto back of hybrid with stencil would also bend hybrid and pump extra glue between stencil and hybrid Slide 3

  4. Chip Stencil Fix Glue Stencil Chip Pickup Tool ABC130 Plastic Bar • Glue a plastic bar onto chip stencil which will touch the chip pickup tool • This has been trialled successfully with 3 pickup tools and two stencils Slide 4

  5. Chip Pickup Tool Fix Plastic Bar Epolite Chip Pickup Tool Hybrid Sensor Bar would locate in the two dowel holes and the additional slot • We want to put a removable bars on chip pickup tool to push on outside of hybrid • Under design and prototyping now • Will add a groove into chip pickup tool to locate and hold bar • Needs to avoid HCC region for both types of hybrids Slide 5

  6. Assembly Future Plans (I) Stencil would be for one hybrid (this shows paper stencil onto sensor for two hybrids • Once pickup tool bar shown to stabilize unsupported hybrid will make metal stencil to screen Epolite onto back of hybrid • Without bar, epoxy will pump between stencil and hybrid, binding hybrid to it. Slide 6

  7. Assembly Future Plans (II) • One of the reasons to change the hybrid pickup tool face to anodized AL is improve the uniformity and stability • Ideally, all tools will be “identical” and therefore interchangeable • In current ABC250 tooling, the same tool has to be used for gluing ASICs-to-hybrids and hybrids-to-sensors • We plan to test this in the next set of hybrid and module assemblies • Will exchange the tooling between ASIC and hybrid gluing • As first test of this, we can exchange jigs after ASIC gluing and curing and the vacuum does not leak and the tool legs all touch Slide 7

  8. Bonding Experience • So far, so good • Not complaints from anyone • Every attempt successful • ~>6 chip cards, 5 hybrids, 1 modules • Much easier than 250 nm (both hybrid and module) • Biggest unexplored issue is the best bonding parameters for the ABC130 metal • Much softer/thicker than ABC25 (more like FEI4) • First chip on boards bonded ok and systematic studies started at Liverpool Slide 8

  9. Jigs Distribution Plans • A set of jigs to do one hybrid sent to Birmingham already to continue accelerated silver epoxy curing studies • Hope to have a jig sets for Cambridge, Glasgow, UCSC, and LBL for hybrids for end of February or beginning of March • ASIC glue stencil, ASIC trays, pickup tools, 8 way jig and module assembly tools from Liverpool • Only one pickup tool per site until bar for pickup tool understood • Module testing plates from LBL • Other 2-3 pickup tools per site and module glue stencil will follow with successful module trialling Slide 9

  10. Component Distribution/Status TM hybrids from Stevenage Mechanical Sensor from HPK Is there an interest in the community for another AL glass ABC130 submission? Glass ASICs from CNM • Orders of 10 panels (2 per site) due back this week (will be before end of February • Plenty (~150) glass and (~100) mechanical sensors • More plain glass ASICs need to be diced (~500-1000); starting at Glasgow • Only component we could be short of is patterned AL glass ABC130s from CNM • Needed for both hybrid and module bonding trials Slide 10

  11. Wish list • We would want a spectrum analyser for power board work (£3.5k) • Might be able to borrow the B180 unit • For submissions, we will need: • £5k for electrical hybrids (40) • £~1k for power board submissions, frames, aux. boards, etc. • £~2k for AL patterned ASICs • We assume next mech and elecrical hybrid submission would get billed after Q1 2014

More Related