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Synergies and Common Issues with 11-T

Synergies and Common Issues with 11-T. B. Auchmann for the CERN/FNAL 11-T collaboration HL-LHC meeting, Nov. 17, 2011 For 11-T design and schedule: see EUCARD meeting talk by M. Karppinen of Nov. 14 , 2011 http:// indico.cern.ch / conferenceTimeTable.py?confId =152511#20111115.

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Synergies and Common Issues with 11-T

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  1. Synergies and Common Issues with 11-T B. Auchmann for the CERN/FNAL 11-T collaboration HL-LHC meeting, Nov. 17, 2011 For 11-T design and schedule: see EUCARD meeting talk by M. Karppinen of Nov. 14, 2011http://indico.cern.ch/conferenceTimeTable.py?confId=152511#20111115

  2. LARP and US Core Programs’ Technology used for 11-T • Conductor • Baseline insulation • Pole pieces, metallic spacers • Ceramic binder/curing matrix • End design experience • Winding/curing tooling + procedure • Handling tooling • Reaction tooling + procedure • Impregnation tooling + procedure • Experience transferred by technicians • Mechanical structure experience • Length scale-up • Lab infrastructure for 2 parallel production lines • Credibility for Nb3Sn accelerator magnet projects B. Auchmann TE-MSC-MDT

  3. Analysis exchange so far .. • Measurement data of HQ and TQ • Exchange on quench simulation and protection strategies • Exchange of ROXIE models B. Auchmann TE-MSC-MDT

  4. 11-T Studies • Insulation alternatives • Passive compensation of persistent currents • Mechanical concepts: • Integrated pole with new gap control and bending (evolution of TQC and HFD ideas). • 2-in-1 version with differential contraction between central posts, gap control, bending. • Pole loading with special care for ends region. • Intra-layer heaters B. Auchmann TE-MSC-MDT

  5. More Common Issues • Tunnel integration:  • Heat extraction (more critical for triplet),  • Electrical connections in tight space (studied also in HL-LHC WP 3, Task 2) • Protection systems: what are realistic delays and thresholds? (currently for nQPS threshold is 800 mV at 3.5 TeV due to electrical perturbations) • Alignment • New conductor generations in PIT an RRP • Radiation resistant epoxies (more critical for triplet) • Gather more experience with cored cable • Study snap back (does it require dedicated correctors?) • Improve analysis capabilities for quench, persistent currents, … B. Auchmann TE-MSC-MDT

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