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TDS (Technical Data Sheet) KP-2100

Mar. 2007 KOLON Electronic Materials B.C. TDS (Technical Data Sheet) KP-2100. KS-8700 Series. GENERAL FEATURES Scum Free Excellent Plating Chemical Tolerance Excellent Alkaline Etching Resistance APPLICATION Plating Process Selective Gold Plating Alkaline Etching

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TDS (Technical Data Sheet) KP-2100

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  1. Mar. 2007 KOLON Electronic Materials B.C. TDS(Technical Data Sheet)KP-2100

  2. KS-8700 Series GENERAL FEATURES Scum Free Excellent Plating Chemical Tolerance Excellent Alkaline Etching Resistance APPLICATION Plating Process Selective Gold Plating Alkaline Etching FILM SPECIFICATION Thickness : 40, 50 mm Color (Unexposed) : Green Color (Exposed) : Blue

  3. General Properties [Circuit Properties] *1: Exposure Energy ; Real Exposure energy (ORC UV meter), *2: Circuit properties : Perkin-Elmer 5Kw Collimated Exposure, KOLON TEST Artwork ( Glass Artwork)

  4. General Properties [Strip Properties] Skin Size - S : Small, M : Medium, L : Large

  5. Sensitivity vs. Exposure Energy • Test condition • Stouffer 21 and 41 Step Tablet, Resist step • Exposure System : Perkin-Elmer 5kw Collimated Exposure

  6. Resolution • Test Condition • Stouffer 21 and 41 Step Tablet, Resist step • Test Artwork : KOLON Test Artwork(Glass Artwork) • Lamination Condition : Auto cut sheet laminator(Hakuto 610-I), Temp. 110 C, Pressure 4kg/cm2, speed 2.0m/min • Develop. condition : 1.0wt% Na2CO3, Temp. 30℃,Break Point 50%, Spray pressure 1.5kg/cm2

  7. Adhesion (Minimum Survived Line Width) • Test Condition • Stouffer 21 and 41 Step Tablet, Resist step • Test Artwork : KOLON Test Artwork(Glass Artwork) • Lamination Condition : Auto cut sheet laminator(Hakuto 610-I), Temp. 110 C, Pressure 4kg/cm2, speed 2.0m/min • Develop. condition : 1.0wt% Na2CO3, Temp. 30℃,Break Point 50%, Spray pressure 1.5kg/cm2

  8. 1/1 Resolution • Test Condition • Stouffer 21 and 41 Step Tablet, Resist step • Test Artwork : KOLON Test Artwork(Glass Artwork) • Lamination Condition : Auto cut sheet laminator(Hakuto 610-I), Temp. 110 C, Pressure 4kg/cm2, speed 2.0m/min • Develop. condition : 1.0wt% Na2CO3, Temp. 30℃,Break Point 50%, Spray pressure 1.5kg/cm2

  9. Strip Properties • Test Condition • Pretreatment ->Lamination->Exposure->Develop->Etching -> Strip • Temperature : 50 C, Conc. : NaOH 3, 4 wt% • TEST Method : Dipping Method

  10. INSTRON Tenting: INSTRON Method Stress : Load of Max load when the 6mm hole broken. Average of 8 times test. Strain : Displacement during the hole broken at Max.load(mm) Average of 8 times test. X = 3Ø Y = 6Ø X = 3Ø Y = 6Ø

  11. SEM Images of KP-2140(X200, X350) Line / Space = 50 / 50 mm 19 / 41SST(7 / 21SST) 22 / 41SST(8 / 21SST) 25 / 41SST(9 / 21SST) 200 Times 350 Times

  12. SEM Images of KP-2150(X250, X400) Line / Space = 50 / 50 mm 19 / 41SST(7 / 21SST) 22 / 41SST(8 / 21SST) 25 / 41SST(9 / 21SST) 250 Times 400 Times

  13. Kolon Step (21) 2 3 4 Kolon Step (21) 5 6 2 7 3 8 4 9 5 10 6 11 7 12 8 13 9 10 14 11 12 13 14 Evaluation Parameters (Sensitivity) Step Held Exposure Development

  14. General Process Guideline * Clean Room: 20~22 °C, 50 ± 10 % RH

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