ITRS Factory Integration

1. ITRS Factory Integration Chairs: Dr. Gopal Rao (Intel) Dr. James Moyne (Appied Materials and University Michigan) moyne@umich.edu Present by Dr. Jonathan Chang (Infineon) Technical Working Group Presentation December 2012

2. Outline • Background • Factory Integration Chapter • 2011-2012 • 2011 focus areas • 2012 table updates • 2013 Revision plans

3. UI Factory Integration (FI) Chapter Today • Factory Integration (FI) Chapter and Factory Information and Control Systems (FICS) Sub-chapter • FI objective: factories and enterprise systems are designed/ integrated for efficient and effective development/ manufacturing • Factory is driven by cost, quality, productivity, and speed • Reduce factory capital and operating costs per function • Faster delivery of new and volume products to the end customer • Efficient/effective volume/mix production, high reliability & equipment reuse • Enable rapid process technology shrinks and wafer size changes • New focus (circa 2007) on waste reduction Factory Operations Production Equipment Factory Information & Control Systems AMHS Facilities • Note: We are thinking of changing this picture for 2013

4. Cycle Time/Operational Flexibility: Multiple lots per carrier and/or fewer wafers per carrier. Get new products to customer much faster. Cycle Time Reduction & Operational flexibility Output per tool must increase: Find breakthrough solutions that result in significant increases in good wafer out and increased OEE (eg: APC, e-Diag) More good wafers out per tool The 300mm factory is much more automated and must be designed to transport hot-lots and hand-carry’s. Highly automated factory Reduce time to $$$/Cycle-time reduction: What are stretch goals for cycle time from ground-breaking to first full loop wafer out. How to achieve quicker shrink? Reduce Time to Money Increased floor space effectiveness: Don’t want each new generation to drive big increase in cleanroom size, esp. since fab is segregated Cu/non-Cu and new metal layers added at each node. Factory size is becoming an issue Factory Integration Requirement Drivers

5. Outline • Background • Factory Integration Chapter • 2011-2012 • 2011 focus areas • 2012 table updates • 2013 Revision plans

6. ITRS 2011-12 Focus • 2011: Major Revision Year • Examples of Topics Addressed • APC and yield; Yield prediction and its use in enhancing APC, scheduling, maintenance, etc. • Moving into the prediction space • Improved Control: Wafer-to-wafer (W2W) control; within-wafer control • Energy conservation and management:Carbon footprint and FI; integration with facilities management; idle mode management • Waste reduction management: cycle time reduction and reduction of white space, waste metrics • Needs and challenges for 450mm • 2012: No changes to tables made

7. Outline • Background • Previous successes • 2011-2012 Updates • 2013 Revision plans

8. Leadership Changes Proposed • Current Factory Integration chapter structure • Chairperson  Gopal Rao, Intel • 2013 proposed leadership • Chairperson  James Moyne, Applied Materials and Univ. of Michigan • 2-year tenure • 2013 and 2014 editions • Gopal Rao of Intel will remain active

9. Factory Integration Target FOModel PE FICS FICS FICS MHS MHS MHS MHS Fac Facility • No table changes proposed for 2012 • For 2013 revision, more emphasis on integration and of all the FI areas High-mix, High-volumeLow-mix, High-volume Integration Requirements to Each Area ESH • Big Data • Reactive to Predictive • Storage Space • OEE improvement • Better Process Controllability • Limited C/R Space Gopal Rao / Factory Integration - 2012

10. UI Ideas Being Discussed for 2013 (1 of 4) • Change the entire FI vision? • Expand the scope between FE / BE integration. • Change the “Silo” style diagram overviewing FI • Emphasize commonality among areas • Emphasize integration of everything • Possibly eliminate or re-organize the sub-chapters • Possibly emphasize data driven • Incorporate impact of non-nano-manufacturing • Consider that fundamentally, 300mm and 450 are the same for FI • Consider possibility of a data driven approach Factory Operations Production Equipment Factory Information & Control Systems AMHS Facilities

11. Ideas Being Discussed for 2013 (2 of 4) • More focus on movement from reactive to predictive • How do you incorporate prediction? • More focus on looking to other industries’ FI practices • (re)define/think KPI’s for FI • E.g., data performance metrics • Question the centralized control concept • Is some from of autonomous control acceptable in some instances? • Control system discussions • Single point of control, predictive control, synchronization • Performance / speed of control • Product synchronization, e.g., RFID

12. Ideas Being Discussed for 2013 (3 of 4) • Address the “Big Data” problem • Big Data Discussion with key TWGs • Litho: EUV/E-beam data volumes • Metro: FI agreed to do AEC/APC write up edits in the Metro section • EHS: Joint teams set up to do common table/write up edits • Agreed to provide inputs to G450C requirements documents • Yld: Joint effort on developing predictive yield models

13. Ideas Being Discussed for 2013 (4 of 4) • More focus on efficiency • Include the roadmap for the supply chain in FI roadmap • Look to see if there is a need for a security roadmap portion • Focus on technology ramps and cost • Process control and DFM need to be integrated • Consider that some FI items are now limiters to achieving major technology milestones • Identify them • Key Points: • It may be time for a major re-thinking  re-writing of the FI chapter • The FI team has already begun discussing these ideas  moving towards consensus

14. Summary • No table changes proposed for 2012 • 2013 will be a major revision year with a strong possibility that there will be a re-thinking of the Factory Integration • FE/BE integration • Prediction • Integration • Data • The Factory Integration Technology Working Group (TWG) is looking for additional input and participation from experts like you

15. Acknowledgements • Gopal Rao (Intel), ITRS FI TWG chair for 2011-12 • ITRS FI members including: • Gopal Rao, Peter Csatary, James Moyne, Dan Mcculley, Makato Yamamoto, SupikaMashiro, Michael Schilp, Boyd Finlay, Jonathan Chang, Les Marshall, Richard Oechsner, Reiner Missale, Leo Kenny, Daniel Babbs, Gino Crispieri, Dan Stevens, , Michael Schilp, Markus Pfeffer, Al Chasey, Shige Koyabashi, Andreas Neuber, Niall Aughney, Eric-Paul Schat, Francesca Illuzzi, Harry Thewissen, Jan-Willem Scheijgrond, Steve Moffatt • The Integrated Measurement Association • Thank you !! 

16. Backup Foils Gopal Rao / Factory Integration - 2012

17. Big Data Description • More sensors, less expensive sensors, higher data rates • No-reticle operation • More analytics produce more data output • Determining what data is important so we collect and then determine importance • Example is data for prediction and control • Merging / connecting data together • Getting the right data from the large data warehouse • How do we handle the data explosion? • Leverage other industries’ IT Gopal Rao / Factory Integration - 2012

18. Other Issues • AMHS scale up (to 450mm is different than other tool types) Gopal Rao / Factory Integration - 2012