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ITRS 2001 Factory Integration Chapter Model Information

ITRS 2001 Factory Integration Chapter Model Information. 1. Fab Ramp Model 2. Fab Capital Cost Model 3. Yield and Profit Model. UI. Factory Integration Scope and Drivers. Factory Operations. Production Equipment. Factory Information & Control Systems. Facilities. AMHS. Si Substrate

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ITRS 2001 Factory Integration Chapter Model Information

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  1. ITRS 2001 Factory Integration Chapter Model Information 1. Fab Ramp Model 2. Fab Capital Cost Model 3. Yield and Profit Model ITRS Factory Integration TWG

  2. UI Factory Integration Scope and Drivers Factory Operations Production Equipment Factory Information & Control Systems Facilities AMHS Si Substrate Mfg Chip Mfg Wafer Mfg Product Mfg Distribution Reticle Mfg • FEOL • BEOL • Probe/Test • Singulation • Packaging • Test Increasing cost & Cycle time implications • Factory is driven by Cost, Productivity, and Speed: • Reduce factory capital and operating costs per function • Faster delivery of new and volume products to the end customer • Efficient high volume production, high reliability, & high equipment reuse • Enable rapid process technology shrinks and wafer size changes ITRS Factory Integration TWG

  3. Manufacturing Strategy Evolution Speed and environment center-minded Throughput center-minded Specific Tech. Level TR (Eq., AMHS, FICS) Effort Effort Specific Tech. Potential Solution (Eq., AMHS, FICS) Factory Operation Requirement Enterprise Level Requirement Current values Next generation Values Wider coverage needed

  4. Search for New Metrics • Carrier Delivery Time Facility ECM Equipment Control Technical Element Level • AMHS T/F Design • AMHS MTTR & MCBF AMHS SCM FICS • Eq. Availability & Utilization Eq. Process Speed Production Flexibility • X Factor Factory Operation Level • NPW Activity • NPW-Start Usage Development Speed ES & H NPW Control • Productivity • Lot Cycle Time • Productivity and flexibility measure for high mix Production Methodology and Constraints • Consumables and cost reduction Enterprise Level Line capability strategy • Floor Space Effectiveness • Energy saving Product Development

  5. More on Speed Agile manufacturing More on Environment Seek Higher Visibility Newer Requirements (Difficult Challenges) • Newer visualization scheme needed • Example1: More of fab floor activity for better governance • Example2: of B factor in y=Ax+B equation for B reduction • Exmaple3: More of fab energy consumption for resource consumption reduction • Need newer metrics and domain concept into production CIM frame work Visualization, Fab Transparency Potential Implementation Solution (System and Contents) • Accomodate various production methodology values in ITRS messages

  6. APC, Yield, and E-Manufacturing Capabilities (EEC) R2R FDC SPC Recipes Data Yield PCS E-Diag EPT What Does a Leading Edge 300mm Fab Look Like Today? High product mix operations enabled using automation 100% AMHS Storage and Intrabay Transport Systems in place Aggressive focus on lot cycle time reduction Pervasive use of Standards for carriers, equipment interfaces, and software systems FOUP carrier tracking using ID tags at load ports Some Wafer Level Tracking & Recipe/Parameter Changes Very high use of APC and Yield systems Factory Scheduler And Material Control Systems Scaled for > 30k wspm Equipment Control Systems Manufacturing Execution Systems Most equipment data feed through SECS/GEM communications All lots and wafers tracked and processed using the MES Equipment Performance Tracking (EPT) Data Some use of E-Diagnostics Partner, Customer Or Supplier

  7. Some Projected Attributes of a 300mm < 45nm Fab Wafer Data Standard For Packaging Data standards and Systems for Rapid Mask Set Creation Very Fast Cycle time Fabs for Hot & Normal lots Equipment & Systems designed for High Mix operation 100% Direct Tool Delivery AMHS Aggressive NPW Reduction & Efficient Spares Mgmt Full Wafer Level Tracking & Recipe/Parameter Changes Systems Scaled for > 50k wspm Ubiquitous APC; Rapid Process Matching & New Product Qualification Manufacturing Execution Systems Equipment Engineering Capabilities Equipment Control Systems SECS Control Line Equipment & Process Data APC FDC SPC Recipes Factory Scheduler And Material Control Yield PCS E-Diag EPT Equipment Data Acquisition (EDA) Standards to get Rich Equipment Data Offline tools to test schedule rules and rapidly put in Mfg Pervasive E-Diagnostics Partner, Customer Or Supplier Standard, Detailed Equipment Performance Tracking (EPT) Data

  8. Fab Ramp Model Assumptions • Factory Size • Metrics are driven by high-volume factories: 40K+ WSPM (or ~9.2K WSPW) that are either: • (a) high-mix factories • More than 5 large volume products, with no one product accounting for more than 50% of all wafers in the factory • (b) low-mix factories • Hot lots : • < 2% of all lots for hi-vol/low-mix; and <10% for hi-vol/hi-mix • Avg # of wafers per hot lot: 5-10 wafers • Ramp rate • Based on leading-edge IC makers first high-volume fab for a major technology node (example 180nm to 130nm) ~20K WSPM Alpha tools Beta tools PO for Production capacity Slope ~ 4900wspm/qtr 400 WSPM ~170 mm2 die 12 months 12 months 12 months ITRS Factory Integration TWG

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