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SRAM-based FPGA

SRAM-based FPGA. SRAM-based LE Registers in logic elements LUT-based logic element Xilinx CLB Altera LE Interconnection Configuration. SRAM-based FPGAs. Program logic functions, interconnect using SRAM. Advantages: Re-programmable dynamically reconfigurable uses standard processes

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SRAM-based FPGA

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  1. SRAM-based FPGA • SRAM-based LE • Registers in logic elements • LUT-based logic element • Xilinx CLB • Altera LE • Interconnection • Configuration

  2. SRAM-based FPGAs • Program logic functions, interconnect using SRAM. • Advantages: • Re-programmable • dynamically reconfigurable • uses standard processes • Disadvantages • SRAM burns power. • Possible to steal, disrupt configuration bits

  3. SRAM Based Logic element • Logic element • includes combinational function + register(s). • Use SRAM as lookup table • for combinational function.

  4. LUT-based logic element n inputs 1 Lookup table configuration bits out Can multiplex at output or address at input

  5. Evaluation of SRAM-based LUT • N-input LUT • can handle function of 2n inputs. • All logic functions • take the same amount of space. • All functions • have the same delay. • SRAM is larger • than static gate equivalent of function. • Burns power • at idle. • Selectively • add register to LE

  6. D Q Registers in logic elements • Register may be selected into the circuit: Configuration bit LUT LE out

  7. Other LE features • Multiple logic functions in an LE • Addition logic • carry chain. • Partitioned lookup tables

  8. Xilinx Spartan-II CLB • Each CLB has two identical slices. • Slice has two logic cells: • LUT. • Carry logic. • Registers.

  9. Spartan-II CLB details • Each lookup table can be used as a 16-bit synchronous RAM or 16-bit shift register. • Arithmetic logic includes an XOR gate. • Each slice includes a mux to ocmbine the results of the two functino generators in the slice. • Register can be configured as DFF or latch. • Has three-state drivers (BUFTs) for on-chip busses.

  10. Spartan-II CLB operation • Arithmetic: • Carry block includes XOR gate. • Use LUT for carry, XOR for sum. • Each slice uses F5 mux to combine results of multiplexers. • F6 mux combines outputs of F5 muxes. • Registers can be FF/latch; clock and clock enable. • Includes three-state output for on-chip bus.

  11. Altera APEX II logic element • Each logic array block has 10 logic elements. • Logic elements share some logic.

  12. Apex II LE modes • Modes of operation: • Normal. • Arithmetic. • Counter.

  13. APEX-II LE normal mode

  14. APEX-II LE arithmetic mode

  15. APEX-II LE counter mode

  16. APEX-II LE control logic

  17. D Q Programmable interconnect • MOS switch • controlled by configuration bit

  18. Programmable vs. fixed interconnect • Programmable interconnect • Switch adds delay. • Transistor off-state is worse in advanced technologies. • FPGA interconnect has extra length = added capacitance.

  19. Interconnect strategies • Some wires • will not be utilized. • Congestion will not be same • throughout chip • Types of wires: • Short wires • local LE connections. • Global wires • long-distance, buffered communication. • Special wires • clocks, etc.

  20. Paths in interconnect • Connection may be long, complex: LE LE LE LE LE Wiring channel LE LE LE LE LE Wiring channel LE LE LE LE LE

  21. Interconnect architecture • Type of connection • Connections from wiring channels to LEs. • Connections between wires in the wiring channels. Wiring channel LE LE

  22. Interconnect richness • Within a channel • How many wires. • Length of segments • Connections from LE to channel • Between channels • Number of connections between channels • Channel structure

  23. Switchbox channel channel channel channel

  24. Spartan-II interconnect • Types of interconnect: • local; • general-purpose; • dedicated; • I/O pin.

  25. Spartan-II general-purpose network • Provides majority of routing resources: • General routing matrix (GRM) • connects horizontal/vertical channels and CLBs. • Interconnect • between adjacent GRMs. • Hex lines • connect GRM to GRMs six blocks away. • 12 longlines • span the chip

  26. Spartan-II routing • Relationship between GRM, hex lines, and local interconnect

  27. Spartan-II three-state bus • Horizontal on-chip busses:

  28. Spartan-II clock distribution

  29. APEX II interconnect row column

  30. Spartan-II I/O • Supports multiple I/O standards • LVTTL, PCI, LVCMOS2, AGP2X, etc. • Provides registers. • Programmable delay for pin-dependent hold time. • Programmable weak keeper circuit.

  31. Spartan-II I/O block diagram

  32. Configuration • Need to set all configuration SRAM bits • minimum pin cost; • reasonable speed. • Configuration can also • be read back for testing

  33. Configuration ROM • Configured on start-up from ROM: FPGA Configuration memory

  34. Spartan-II configuration • Configuration length • depends on size of chip • 200,000 to 1.3 million bits. • Configuration modes • Master serial • for first chip in chain. • Slave serial • for follow-on chips. • Slave parallel • Boundary-scan

  35. Scan chain • Scan chain • shift register used to access internal state. • Logic-sensitive scan design (LSSD) • scan structure that uses some hardware for normal mode and scan.

  36. JTAG boundary scan • JTAG • Joint Test Action Group. • Boundary scan • provide scan chain at pins • allow control of chip interior • decouple chip from rest of board for test

  37. Chip-on-board testing • Boundary scan decouples chips: board

  38. Boundary scan concepts • TAP: test access port. • Requires three pins not shared with other logic. • Test reset, test clock, test mode select, test data in, test data out. • TAP controller • recognizes pins, controls boundary scan registers. • Instruction register • defines boundary scan mode.

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