1 / 13

DEVELOPMENT OF THE CBM-MVD: THE PROTOTYPE

DEVELOPMENT OF THE CBM-MVD: THE PROTOTYPE. Michal Koziel o n behalf of CBM-MVD collaboration. Michal.Koziel@Physik.uni-frankfurt.de (+49) 069 / 798-47119. The MVD – required performances. CBM-MVD will: improve secondary vertex resolution

lenora
Download Presentation

DEVELOPMENT OF THE CBM-MVD: THE PROTOTYPE

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. DEVELOPMENT OF THE CBM-MVD:THE PROTOTYPE Michal Koziel on behalf of CBM-MVD collaboration Michal.Koziel@Physik.uni-frankfurt.de (+49) 069 / 798-47119

  2. The MVD – required performances • CBM-MVD will: • improve secondary vertex resolution • host highly granular silicon pixel sensors featuring fast read-out, excellentspatial resolution and robustness to radiation environment. See P.Senger introduction

  3. Research fields towards the MVD Sensor development Radiation tolerance Support & cooling System integration M.Winter Front-End Electronics Main challenges: • Provide fast and radiation tolerant sensor featuring low material budget • Develop sensor readout system capable to handle high data rates J.Stroth • Provide cooling and support with low material budget

  4. Progress towards the MVD Prototype Demonstrator 4 sensors ½ of 1st station Final ...will meet all requirements 2012 2010 2008 Sensor: MIMOSA-20 ~200 frames/s few 1011 neq/cm2 & ~300 kRad 750µm thick Sensor: MIMOSA-26 AHR ~10 kframes/s ~1013 neq/cm2& >300 kRad 50µm thick Sensor: MIMOSIS-1 (diff. geometry) Readout speed ~30 kframes/s 2015 Radiation tol. >1013 neq/cm2& >3 MRad Readout Serial/analog Readout CP/digital/high data rates Cooling & support: CVD diamond Cooling & support: TPG+RVC foam Material budget: ~ 2.45 % X0 Material budget: ~ 0.3 % X0

  5. Sensors for the MVD prototype MIMOSA-26 AHR 0.35µm process High Resistivity (HR) EPI (400Ω·cm) 21.2 x 10.6 mm2 18.4 µm pixel pitch Main features: - in pixel amplification - comparator for each column - 0 suppression logic - pitch: 18.4 μm∼ 0.7 million pixels CMOS processes with smaller feature size (0.18µm) • CMOS processes with smaller feature size (0.18µm) • Sensor geometry – column length Extensively studied at IKF: [1] M.Deveaux „Radiation tolerance of a column parallel CMOS sensor with high resistivity epitaxial layer”, accepted for publication in Journal Of Instrumentation 2011

  6. Readout concept for MVD prototype Clk Start Reset JTAG Driver board FEB CB RCB PEXOR PC PCI optical receiver multiwire LVDS 5 x 800MBit/s multiwire LVDS 5 x 1GBit/s Optical Fibers 1 optical link 5 x 300MBit/s Optical Fibers CBM DAQ Powering LVDS drivers Current & temperature monitoring Powering Latchup detection Current & temperature monitoring LVDS to Optical conversion vacuum Data reduction Time stamping Slow control Fast control LVDS to Optical Data reduction Time stamping Slow control Fast control Data concentrator Signal distribution Filtering FEB – Front End Board // CB – Converter Board // RCB – Readout Controller Board

  7. Low voltage distribution • Main objectives: • On-line current monitoring • Latch-up detection & handling (based on STAR solution) • Possibility to use radiation tolerant components (CERN) Slow control

  8. Mechanical design Cooling Cooling & carrier * Heat Sink Heat Sink Carrier * - @ +20C , >3000W/mK @-50C Demonstrator Prototype Flex Cable Sensor Sensor Flex Cable R/O R/O TPG Cu heat sink CVDD 300µm RVC Cu heat sink R/O TPG Sensors thinned down to 50µm R/O 750µm thick sensors Material budget ~2.45% X0 Material budget ~0.35% X0 TPG - Thermal Pyrolitic Graphite RVC - Reticulated Vitreous Carbon

  9. Mechanical design Flex Cable Sensor R/O Cu heat sink CVDD 300µm R/O

  10. Improving connectivity and handling  SERWIETE (SEnsor Row Wrapped In an Extra Thin Envelope) IMEC (Belgium) + IKF Frankfurt + IPHC Strasbourg (sensors) Radiation tolerance ? Reliability ? Thermal cycles ? Real material budget ?

  11. IKF Technology Lab Digital Microscope Keyence VHX-600 Probe Station PA200 (Suss-Microtec) Thermal imaging system (VarioCAM HiRes 640) 10-7 mBar vacuum chamber

  12. Conclusions & Summary • The concept of the MVD read-out is defined • The hardware components for MVD prototye have been delivered to the IKF • Assembly and debugging in progress • Software development is ongoing • Lab tests to be performed • In parallel – software developments • Challanges: • Deliver MIMOSIS-1 – with required radiation tolerance & readout speed for MVD • Most optimum read-out • Connectivity • Second station – large area sensors…

  13. Thank you for your attention... CBM-MVD Collaboration members: Samir Amar-Youcef, Norbert Bialas, Michael Deveaux, Dennis Doering, Melissa Domachowski, Christina Dritsa, Horst Düring, Ingo Fröhling, Tetyana Galatyuk, Michal Koziel, Jan Michel, Boris Milanovic, Christian Müntz, Bertram Neumann, Paul Scharrer, Christoph Schrader, Selim Seddiki, Joachim Stroth, Tobias Tischler, Christian Trageser, Bernhard Wiedemann Jérome Baudot, Grégory Bertolone, Nathalie Chon-Sen, Gilles Claus, Claude Colledani, Andrei Dorokhov, Wojchiech Dulinski, Marie Gelin-Galivel, Mathieu Goffe, Abdelkader Himmi, Christine Hu-Guo, Kimmo Jaaskelainen, Frédéric Morel, Fouad Rami, Mathieu Specht, Isabelle Valin, Marc Winter

More Related